5
Electrical installation
Installation planning taking EMC aspects into account
Operating Instructions – MOVIFIT
®
MC
36
5.2.1
Equipotential bonding
Regardless of the PE connection, it is essential that low-impedance,
HF-capable
equipotential bonding
is provided (see also EN 60204-1 or DIN VDE 0100-540):
• Establish a connection over a wide surface
area between the MOVIFIT
®
mounting rail
and the system (untreated, unpainted, un-
coated mounting surface).
• To do so, use a ground strap (HF litz wire) to
connect MOVIFIT
®
and the system's ground-
ing point.
[1]
[3]
[2]
[4]
9007200851970059
[1] Conductive connection over a large area
between MOVIFIT
®
unit and the mounting
plate
[2] PE conductor in the supply cable
[3] 2nd PE conductor via separate terminals
[4] EMC-compliant equipotential bonding, for
example using a ground strap (HF litz wire)
• Do not use the cable shields of data lines for equipotential bonding.
5.2.2
Data lines and 24 V supply
Route data lines and 24 V supply separately from cables that emit interference (such
as control cables of solenoid valves, motor cables).
5.2.3
Connection between MOVIFIT
®
and MOVIMOT
®
Only use hybrid cables from SEW
‑
EURODRIVE for the connection between
MOVIFIT
®
and MOVIMOT
®
.
5.2.4
Line shields
• Must have good EMC properties (high screening attenuation)
• May not serve only as mechanical protection for the cable
• Must be connected to a wide area of the unit's metal housing at the cable ends
(see also chapter "Connecting the PROFIBUS cable" (
19484828/EN – 01/2015
