12
Technical data
12.1
General technical data
Mechanical data
1
: L
+
2
: D
I
2
3
: 0
V
4
:
C
/
DI
1
/
DO
1
5
: N
C
1
: T
X
+
2
: R
X
+
3
: T
X
–
4
: R
X
–
IO
-L
in
k
1
5
3
8
7
L
L
IN
D
. C
O
N
T.
EQ
Ty
p
e
1
En
c
.
4
2
2
4
3
1
1
: L
+
2
: N
C
3
: 0
V
4
: N
C
1
: +
VD
C
2
: –
D
A
T
A
3
: 0
V
4
: +
D
A
T
A
C
O
NF
IG
P
O
W
E
R
S
1
-
S
4
2
1
-
P
2
IO
-L
in
k
S
IG
2
0
0
-0
A
1
0
A
0
0
1
0
8
0
5
7
9
1
0
-3
0
V
D
C
O
U
T
<
1
0
0
m
A
A
ss
e
m
b
le
s
in
U
S
A
LN
{
YY
W
W
}:
POWER
SF
BF
C/DI/DO
DI
C/DI/DO
DI
C/DI/DO
DI
C/DI/DO
DI
LINK
ACT2
LINK
ACT1
SF
POWER
BF
/DO
DI
/DO
DI
/DO
DI
/DO
DI
LINK
ACT2
LINK
ACT1
SIG200
POWER
CONFIG
S1
S2
S3
S4
P2
P1
9
(0.35)
38.3
(1.51)
30
(1.28)
57
(2.24)
36
(1.42)
28
(1.1)
1
9
8
.5
(
7
.8
1
)
2
1
3
.9
(
8
.4
2
)
1
4
3
2
P
R
O
F
INE
T
Figure 33: Dimensional drawing
Housing material
Zinc
Enclosure rating per IEC 60529
IP 67 (only when plugged-in and threaded-in)
1
Dimensions (W x H x D)
213.9 x 38.3 x 57 mm
Mounting type
Mounting slots front and side
Weight
520 g
1
If cables are not plugged in the connector caps supplied with the device must be tightened to 0.35 Nm
Operating conditions
Operating temperature
-40 °C ... +55°C
Storage temperature
-40 °C ... +75°C
TECHNICAL DATA
12
8017853.1D0S/2021-11-04 | SICK
O P E R A T I N G I N S T R U C T I O N | Sensor Integration Gateway - SIG200
125
Subject to change without notice
