Copyright © Siemens AG 2016. All rights reserved
500
ERTEC 200P-2 Manual
Technical data subject to change
Version
1.0
7 MISCELLANEOUS
7.1 Abbreviations
Abbreviation Description
AHB
AMBA
A
dvanced
H
igh-performance
B
us
AMBA
A
dvanced
M
icrocontroller
B
us
A
rchitecture
APB
AMBA
A
dvanced
P
eripheral
B
us
AR
A
pplication
R
elationship (e.g. controller <-> device)
CR
C
ommunication
R
elationship (e.g. input data / output data)
D_TCM
D
ata
T
ightly
C
oupled
M
emory
DFT
D
esign
F
or
T
est
DFP
D
ynamic
F
rame
P
acking
GDMA
G
eneric
D
irect
M
emory
A
ccess
EMC
E
xternal
M
emory
C
ontroller
ETB
E
mbedded
T
race
B
uffer
ETM
E
mbedded
T
race
M
acrocell
FIQ
F
ast
I
nterrupt
R
e
q
uest
GPIO
G
eneral
P
urpose
I
nput/
O
utput
HW
H
ard
w
are
I_TCM
I
nstruction
T
ightly
C
oupled
M
emory
ICU
I
nterrupt
C
ontrol
U
nit
IRQ
I
nterrupt
R
e
q
uest
IRT
I
sochronous
R
eal
T
ime
IRT High
Performance
I
sochronous
R
eal
T
ime with fast-forwarding, pack/unpack, and
NRT fragmentation
ISR
I
nterrupt
S
ervice
R
egister
IP
Intellectual Property
JTAG
J
oint
T
est
A
ction
G
roup
MC
M
otion
C
ontrol
NMI
N
on
M
askable
I
nterrupt
NRT
N
on-
R
eal
T
ime
PCB
P
rinted
C
ircuit
B
oard
PCI
P
eripheral
C
ommunication
I
nterface
PHY
Phy
sical Layer
PLL
P
hase
L
ocked
L
oop
PNPLL
P
ROFI
N
ET
PLL
RT
S
oft
R
eal
T
ime
SCRB
S
ystem
C
ontrol
R
egister
B
lock