SiM3U1xx
Preliminary Rev. 0.8
33
3.2. Thermal Conditions
3.3. Absolute Maximum Ratings
Stresses above those listed under Table 3.20 may cause permanent damage to the device. This is a stress rating
only and functional operation of the devices at those or any other conditions above those indicated in the operation
listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect
device reliability.
Table 3.19. Thermal Conditions
Parameter
Symbol
Conditions
Min
Typ
Max
Units
Thermal Resistance*
JA
LGA-92 Packages
—
35
—
°C/W
TQFP-80 Packages
—
40
—
°C/W
QFN-64 Packages
—
25
—
°C/W
TQFP-64 Packages
—
30
—
°C/W
QFN-40 Packages
—
30
—
°C/W
*Note:
Thermal resistance assumes a multi-layer PCB with any exposed pad soldered to a PCB pad.
Table 3.20. Absolute Maximum Ratings
Parameter
Symbol
Conditions
Min
Max
Units
Ambient Temperature Under Bias
T
BIAS
–55
125
°C
Storage Temperature
T
STG
–65
150
°C
Voltage on VDD
V
DD
V
SS
–0.3
4.2
V
Voltage on VREGIN
V
REGIN
EXTVREG0 Not Used
V
SS
–0.3
6.0
V
EXTVREG0 Used
V
SS
–0.3
3.6
V
Voltage on VBUS
V
BUS
V
IO
> 3.3 V
V
SS
–0.3
5.8
V
V
IO
< 3.3 V
V
SS
–0.3
V
IO
+2.5
V
Voltage on VIO
V
IO
V
SS
–0.3
4.2
V
Voltage on VIOHD
V
IOHD
V
SS
–0.3
6.5
V
Voltage on I/O pins, non Port Bank 3 I/O
V
IN
RESET, V
IO
> 3.3 V
V
SS
–0.3
5.8
V
RESET, V
IO
< 3.3 V
V
SS
–0.3
V
IO
+2.5
V
Port Bank 0, 1, and 2 I/O
V
SS
–0.3
V
IO
+0.3
V
Port Bank 4 I/O
V
SSHD
–0.3
V
IOHD
+0.3
V
D+ and D–, VIO > 3.3 V
V
SS
–0.3
5.8
V
D+ and D–, VIO < 3.3 V
V
SS
–0.3
V
IO
+2.5
V
*Note:
VSS and VSSHD provide separate return current paths for device supplies, but are not isolated. They must always be
connected to the same potential on board.