S i M 3 U 1 x x
34
Preliminary Rev. 0.8
Voltage on I/O pins, Port Bank 3 I/O
V
IN
SiM3U1x7, PB3.0–
PB3.7, V
IO
> 3.3 V
V
SS
–0.3
5.8
V
SiM3U1x7, PB3.0–
PB3.7, V
IO
< 3.3 V
V
SS
–0.3
V
IO
+2.5
V
SiM3U1x7, PB3.8 -
PB3.11
V
SS
–0.3
Lowest of
V
IO
+2.5,
V
REGIN
+0.3,
or 5.8
V
SiM3U1x6, PB3.0–
PB3.5, V
IO
> 3.3 V
V
SS
–0.3
5.8
V
SiM3U1x6, PB3.0–
PB3.5, V
IO
< 3.3 V
V
SS
–0.3
V
IO
+2.5
V
SiM3U1x6, PB3.6–
PB3.9
V
SS
–0.3
Lowest of
V
IO
+2.5,
V
REGIN
+0.3,
or 5.8
V
SiM3U1x4, PB3.0–
PB3.3
V
SS
–0.3
Lowest of
V
IO
+2.5,
V
REGIN
+0.3,
or 5.8
V
Total Current Sunk into Supply Pins
I
SUPP
V
DD
, V
REGIN
, V
IO
, V
IOHD
—
400
mA
Total Current Sourced out of Ground
Pins
I
VSS
V
SS,
V
SSHD
400
—
mA
Current Sourced or Sunk by Any I/O Pin
I
PIO
PB0, PB1, PB2, PB3,
and RESET
–100
100
mA
PB4
–300
300
mA
Current Injected on Any I/O Pin
I
INJ
PB0, PB1, PB2, PB3,
and RESET
–100
100
mA
PB4
–300
300
mA
Total Injected Current on I/O Pins
I
INJ
Sum of all I/O and
RESET
–400
400
mA
Power Dissipation at T
A
= 85 °C
P
D
LGA-92 Package
—
570
mW
TQFP-80 Package
—
500
mW
QFN-64 Package
—
800
mW
TQFP-64 Package
—
650
mW
QFN-40 Package
—
650
mW
Table 3.20. Absolute Maximum Ratings (Continued)
Parameter
Symbol
Conditions
Min
Max
Units
*Note:
VSS and VSSHD provide separate return current paths for device supplies, but are not isolated. They must always be
connected to the same potential on board.