8.2 Recommended PCB Land Pattern
The recommended PCB Land Pattern is shown in
Figure 8.3 Module Land Pattern on page 41
Figure 8.3. Module Land Pattern
Table 8.2. PCB Land Pattern Dimensions
Dimension
Typ (mm)
D1
4.50
D2
2.65
E1
4.50
E2
2.25
eD1
0.45
eD2
0.90
b
0.25
e
0.50
L
0.35
L1
0.50
Note:
1. All feature sizes shown are at Maximum Material Condition (MMC) and a card fabrication tolerance of 0.05mm is assumed.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.
4. The stencil thickness should be 0.100 mm (4 mils).
5. The stencil aperture to land pad size recommendation is 80% paste coverage.
6.
Above notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use
different parameters and fine tune their SMT process as required for their application and tooling.
BGM220S Wireless Gecko Bluetooth
®
Module Data Sheet
Package Specifications
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