Smart Machine Smart Decision
SIM868_Series_Hardware_Design_V1.06
64
2017-07-13
9.3.
The Moisture Sensitivity Level
The moisture sensitivity level of SIM868 module is 3. The modules should be mounted within 168 hours after
unpacking in the environmental conditions of temperature <30
℃
and relative humidity of <60% (RH). It is
necessary to bake the module if the above conditions are not met:
Table 46: Moisture sensitivity level and floor life
Moisture Sensitivity Level
(MSL)
Floor Life (out of bag) at factory ambient≤30°C/60% RH or as stated
1
Unlimited at
≦
30
℃
/85% RH
2
1 year
2a
4 weeks
3
168 hours
4
72 hours
5
48 hours
5a
24 hours
6
Mandatory bake before use. After bake, it must be reflowed within the time limit
specified on the label.
NOTES:
1. If the vacuum package is not open for 3 months or longer than the packing date, baking is also
recommended before re-flow soldering.
2. For product handling, storage, processing, IPC / JEDEC J-STD-033 must be followed.
9.4.
Baking Requirements
SIM868 modules are vacuum packaged, and guaranteed for 6 months storage without opening or leakage under
the following conditions: the environment temperature is lower than 40
℃
, and the air humidity is less than 90%.
If the condition meets one of the following ones shown below, the modules should be baked sufficiently before
re-flow soldering, and the baking condition is shown in table below; otherwise the module will be at the risk of
permanent damage during re-flow soldering.
If the vacuum package is broken or leakage
;
If the vacuum package is opened after 6 months since it’s been packed
;
If the vacuum package is opened within 6 months but out of its Floor Life at factory ambient
≦
30
℃
/60%RH or as stated
.
Table 47: Baking requirements
Baking temperature
Moisture
Time
40
℃
±5
℃
<5%
192 hours
120
℃
±5
℃
<5%
4 hours
Note: Care should be taken if that plastic tray is not heat-resistant, the modules should be taken out for
preheating, and otherwise the tray may be damaged by high-temperature heating.
SIMCOM
CONFIDENTIAL
FILE
