AM-NX1
39
39
6-3.
NOTE FOR PRINTED WIRING BOARD AND SCHEMATIC DIAGRAMS
Note on Printed Wiring Board:
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
f
: internal component.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side)
the parts face are indicated.
• MAIN board is multi-layer printed board.
However, the patterns of intermediate layers have not
been included in this diagrams.
• Lead Layouts
surface
Lead layout of conventional IC
CSP (chip size package)
Note on Schematic Diagram:
• All capacitors are in
µ
F unless otherwise noted. pF:
µµ
F
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
f
: internal component.
•
C
: panel designation.
•
A
: B+ Line.
• Total current is measured with MD installed.
• Power voltage is dc 3 V and fed with regulated dc power
supply from DC IN 3 V jack (JK951).
• Voltages and waveforms are dc with respect to ground in
playback mode.
no mark : PLAYBACK
(
) : REC
〈〈
〉〉
: USB
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
J
: PLAYBACK
f
: REC
F
: USB
• Abbreviation
HK
: Hong Kong model
• Waveforms
1
IC501
9
(RFO)
3
IC501
rs
(FE)
4
IC501
rd
(TE)
5
IC801
2
(OSCO)
6
IC801
ef
(CLK)
7
IC801
<z,/>
(UOSCO) (USB mode)
2
IC501
wh
(CLK)
Note: The components identified by mark
0
or dotted line
with mark
0
are critical for safety.
Replace only with part number specified.
8
IC651
5
(EXT) (USB mode)
9
Q653 (Base) (USB mode)
1.2 Vp-p
3.1 Vp-p
88 ns
Approx.
350 mVp-p
Approx.
400 mVp-p
2.1 Vp-p
44.6
µ
s
2.3 Vp-p
5.7
µ
s
2.7 Vp-p
21 ns
3.3 Vp-p
9.8
µ
s
0.7 Vp-p
9.8
µ
s
∗
Replacement of IC501 and IC801 used in this set re-
quires a special tool.
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
form that of conventional IC.
∗
Replacement of IC501 and IC801 used in this set re-
quires a special tool.
Summary of Contents for AM-NX1
Page 36: ...36 AM NX1 MEMO ...
