– 2 –
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED
LINE WITH MARK
0
ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
TABLE OF CONTENTS
1.
SERVICING NOTES
...............................................
3
2.
GENERAL
...................................................................
4
3.
DISASSEMBLY
.........................................................
5
4.
ELECTRICAL ADJUSTMENTS
.........................
7
5.
DIAGRAMS
5-1. Block Diagram – MAIN Section (1/2) – ........................
9
5-2. Block Diagram – MAIN Section (2/2) – ........................ 11
5-3. Block Diagram – POWER SUPPLY Section – .............. 13
5-4. Printed Wiring Board ...................................................... 16
5-5. Schematic Diagram ......................................................... 19
5-6. IC Pin Function Description ........................................... 27
6.
EXPLODED VIEWS
................................................ 29
7.
ELECTRICAL PARTS LIST
............................... 32
This appliance is classified as a CLASS 1 LASER product.
The CLASS 1 LASER PRODUCT MARKING is located on
the rear exterior.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
