18
18
CDX-S22/S22S
CDX-S22/S22S
For schematic diagrams.
Note:
•
All capacitors are in
µ
F unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
•
All resistors are in
1
and
1
/
4
W or less unless otherwise
specified.
•
f
: internal component.
•
C
: panel designation.
For printed wiring boards.
Note:
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
a
: Through
hole.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
•
A
: B+ Line.
•
B
: B– Line.
•
V
oltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
•
CD mechanism section (1/2), (2/2)
no mark
:
CD
PLA
Y
•
Main (1/2), (2/2) and Key sections
no mark
: FM
(
)
:
AM or MW
<
>
: CD PLA
Y
: Impossible to measure
•
V
oltages are taken with a VOM (Input impedance 10 M
1
).
V
oltage variations may be noted due to normal production
tolerances.
•
W
aveforms are taken with a oscilloscope.
V
oltage variations may be noted due to normal production
tolerances.
•
Circled numbers refer to waveforms.
•
Signal path.
J
: CD
F
: FM
f
:
AM or MW
•
Abbreviation
MX
: Mexican model.
CH
: Chinese model.
Caution:
Pattern
face
side:
Parts on the pattern face side seen from the
(Side B)
pattern face are indicated.
Parts
face
side:
Parts on the parts face side seen from the
(Side A)
parts face are indicated.
Q
C
These are omitted.
E
B
E
These are omitted.
C
B
C
These are omitted.
B
E
•
Abbreviation
MX
: Mexican model.
CH
: Chinese model.
• W
aveforms
1
IC2
5
(FEI)
Approx.
1Vp-p
0 V
0.6 Vp-p
16.9344 MHz
Approx. 100 mVp-p
50 mV/DIV, 5 msec/DIV
0.5 V/DIV, 0.5
µ
sec/DIV
2
IC2
6
(TEI)
200 mV/DIV, 5 msec/DIV
6
IC2
oh
(FPI2),
0.5 V/DIV, 0.5
µ
sec/DIV
Approx. 400 mVp-p
3
IC2
wd
(XI)
0.2 V/DIV, 0.2
µ
sec/DIV
7
IC3
ia
(X1)
0.5 V/DIV, 0.2
µ
sec/DIV
1.1 Vp-p
12 MHz
4
IC2
ia
(RFI)
0.5 V/DIV, 0.5
µ
sec/DIV
5
IC2
of
(FNI2),
og
(FNI1)
1.5 Vp-p
oj
(FPI1)
1.5 Vp-p
0 V
— SER
VO Board —
(CD PLA
Y)
— MAIN Board —
2 Vp-p
32.768 kHz
1
IC501
i;
(XOUT)
2.3 Vp-p
18.432 MHz
2
IC501
id
(OSCOUT)
0.5 V/DIV, 0.1
µ
sec/DIV
1.8 Vp-p
8.664 MHz
3
IC51
9
(XTI)
0.5 V/DIV, 0.2
µ
sec/DIV
0.2 V/DIV, 20
µ
sec/DIV
Note:
The components identified by mark
0
or dotted line
with mark
0
are critical for safety
.
Replace only with part number specified.
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS
AND SCHEMA
TIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
