2
TABLE OF CONTENTS
1. GENERAL
............................................................................ 3
2. DISASSEMBLY
2-1. Cabinet (Front) Assy, Cabinet (Rear) Assy ......................... 4
2-2. Power and DC IN Boards .................................................... 5
2-3. Mechanism Deck ................................................................. 5
2-4. H/P, LED2, Maxi Bass, VOL and Main Boards .................. 6
2-5. F/T and Tuner Boards .......................................................... 6
2-6. Jog and LED1 Boards ......................................................... 7
2-7. REC SW Board, Belt and Motor Assy (W) (M301) ........... 7
3. DIAL POINTER SETTING
............................................. 8
4. MECHANICAL ADJUSTMENTS
................................. 9
5. ELECTRICAL ADJUSTMENTS
Tape Section ............................................................................ 9
Tuner Section ......................................................................... 10
6. DIAGRAMS
6-1. Circuit Boards Location .................................................... 12
6-2. Block Diagram .................................................................. 13
6-3. Printed Wiring Boards – Tuner Section – ......................... 14
6-4. Schematic Diagram – Tuner Section – .............................. 15
6-5. Printed Wiring Boards – Main Section – .......................... 16
6-6. Schematic Diagram – Main Section (1/2) – ...................... 17
6-7. Schematic Diagram – Main Section (2/2) – ...................... 18
6-8. Printed Wiring Boards – Power Section – ......................... 19
6-9. Schematic Diagram – Power Section – ............................. 20
7. EXPLODED VIEWS
7-1. Cabinet (Rear) Section ...................................................... 23
7-2. Cabinet (Front) Section-1 .................................................. 24
7-3. Cabinet (Front) Section-2 .................................................. 25
7-4. Mechanism Deck Section-1 .............................................. 26
7-5. Mechanism Deck Section-2 .............................................. 27
7-6. Mechanism Deck Section-3 .............................................. 28
7-7. Speaker Section ................................................................. 29
8. ELECTRICAL PARTS LIST
........................................ 30
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
Notes on Chip Component Replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
CFS-828SMK2
•
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
Summary of Contents for CFS-828SMK2
Page 37: ...37 CFS 828SMK2 MEMO ...