20
20
CX-LEM550
7-4. PRINTED WIRING BOARD — MAIN BOARD —
•
See page 15 for Circuit Boards Location.
:Uses unleaded solder.
E
E
E
Q333
Q315
Q338
E
Q342
Q343
E
E
Q329
Q330
Q328
Q332
Q331
E
E
E
E
E
Q320
E
Q327
Q326
E
E
E
IC302
E
E
E
E
E
E
E
E
E
E
E
E
E
E
JR302
JR303
E
MAIN BOARD
R
L
1-861-718-
5
6
7
1
2
3
4
L-CH
REC/PB
HEAD
R-CH
ERASE
HEAD
1
3
28
15
1
14
2
6
5
4
R
L
+
+
−
−
MD
J303
SPEAKER
IMPEDANCE
USE6-16
Ω
J302
• Semiconductor
Location
Ref. No.
Location
D301
F-6
D302
C-3
D303
D-3
D304
E-4
D305
B-5
D306
B-5
D307
E-6
D308
F-5
D309
A-4
D310
E-5
D311
E-6
D312
D-3
D313
D-3
D317
E-6
D318
F-4
D319
G-4
D320
C-3
D386
D-5
D387
D-4
D388
D-3
D389
D-3
D390
B-1
D392
C-2
D393
B-2
D396
A-3
IC302
B-5
Q311
F-5
Q312
E-4
Q313
E-4
Q314
E-4
Q315
F-6
Q317
C-4
Q319
D-3
Q320
C-3
Q326
B-6
Q327
B-6
Q328
A-6
Q329
A-6
Q330
A-6
Q331
A-6
Q332
A-7
Q333
F-6
Q334
G-5
Q335
G-5
Q336
G-5
Q337
F-4
Q338
F-6
Q342
C-5
Q343
C-4
Q344
D-6
Q345
D-6
Q346
C-6
Q347
C-5
Q348
D-6
Q349
D-4
Q350
G-4
Summary of Contents for CX-LEM550
Page 47: ...47 CX LEM550 MEMO ...