4
4. You should apply enough pressure to shear off 4-5 legs as you rock
the blade while pressing down. DO NOT let the blade point touch the
board.
5. Reposition the blade back along the legs and repeat. Do not cut the
last leg off or you will lose control and the blade point will hit the board.
Use cutters to nip these last IC legs or unsolder and lift the leg with a
dental pick. Remove the IC body.
6. Use a standard soldering iron to heat and push the legs off the lands.
Push only in the direction of the lands so they are not damaged.
Wipe across
the land
IC Lands
7. Remove the solder on the lands using a solder wick looped about the
soldering iron for better control.
Summary of Contents for DVP-S300
Page 4: ...1 NOTES ...
Page 13: ...10 NOTES ...
Page 19: ...16 NOTES ...
Page 25: ...22 NOTES ...
Page 29: ...26 NOTES ...
Page 35: ...32 2ND GENERATION OPTICAL ASSEMBLY SYMPTOM 3 1 3 01 19DVD03 ...
Page 39: ...36 NOTES ...
Page 61: ...58 Flex Cable DVP C650 ...
Page 71: ...68 NOTES ...
Page 76: ...APPENDIX ...