21
21
HCD-CL1/CL3
SECTION 7
DIAGRAMS
7-1. CIRCUIT BOARDS LOCATION
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed
in each block.)
For schematic diagrams.
Note:
• All capacitors are in
µ
F unless otherwise noted. pF:
µµ
F
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
f
: internal component.
•
2
: nonflammable resistor.
•
1
: fusible resistor.
•
C
: panel designation.
For printed wiring boards.
Note:
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
a
: Through hole.
•
: Pattern from the side which enables seeing.
•
A
: B+ Line.
•
B
: B– Line.
•
H
: adjustment for repair.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: FM
E
: PB
a
: REC
J
: CD (Analog)
c
: CD (Digital)
• Abbreviation
AUS
: Australian model
MX
: Mexican model
TW
: Taiwan model
KR
: Korea model
Note: The components identified by mark
0
or dotted line
with mark
0
are critical for safety.
Replace only with part number specified.
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B)
pattern face are indicated.
Parts face side:
Parts on the parts face side seen from the
(Side A)
parts face are indicated.
• Indication of transistor
C
B
These are omitted.
E
Q
B
These are omitted.
C
E
B
These are omitted.
C
E
AMP board
MAIN board
TRANS board
TC board
RING SW board
PANEL board
BACK LIGHT board
THERMAL board
VOL SEL board
SUB POWER board
MOTOR board
DRIVER board
TRAY SENSOR board
DISK SENSOR board
BD (CD) board
IN OUT SW board
