44
44
HCD-DZ500F
HCD-DZ500F
5-19. PRINTED WIRING BOARD – PANEL SECTION (2/2) –
•
See page 21 for Circuit Boards Location.
IC605
E
E
E
E
5
1
MAIN
BOARD
CN309
(Page 34)
H
PHONES
J801
1
4
AUDIO IN
J603
I/O
BOARD
CN602
(Page 47)
G
M
42
5
1
CN001
1-861-327-
12,21
S001
(CHUCK/TRAY DETECT)
M203
(LOADING)
J
DMB10
BOARD
CN202
(Page 27)
MS-203 BOARD
+
-
12
12
12
12
1
2
A
B
C
D
3
4
5
6
7
• Semiconductor
Location
Ref. No.
Location
D821
A-2
D822
B-2
IC605
B-4
Q806
B-2
Q807
B-2
Q808
B-2
Q809
B-2
:Uses unleaded solder.