24
HCD-DZ830W/DZ850KW
3-13. MAIN BOARD, DSP BOARD
•
Abbreviation
E32 : 110 – 240V AC area in E model
MX : Mexican model
SP
: Singapore model
3
connector
2p (CN901)
2
two SUPPORT boards
1
connector
4p (CN3002)
Attaching the two radiation sheets
on the IC MAIN board first, and then
attach the heatsink (AMP).
heatsink (AMP)
radiation
sheets
IC on the
MAIN board
7
two screws (+BV 3
×
10)
9
heatsink (AMP),
HEATSINK B board,
HEATSINK A board
q;
two radiation sheets
8
screw (+BVTP 3
×
12)
4
INSULATOR
board
5
three screws (+BV 3
×
6)
wd
four screws
(+BV 3
×
6)
wf
two screws
(+BV 3
×
6)
heatsink
(AMP)
harness
lead pin
heatsink
(AMP)
harness
(D.C. fan)
harness
lead pin
screw
Clamp the harnesses with a lead pin or a similar tool so that
they do not touch this screw and the heatsink (AMP).
Clamp the harness with a lead pin
or a similar tool so that they do not
touch the heatsink (AMP).
qs
connector
6p (CN1201)
qf
connector
12p (CN906)
qa
wire (flat type) 24core (CN1101)
ws
wire (flat type) 11core (CN651)
wire (flat type)
5core (CN1202)
wire (flat type) 11core (CN4302) (DZ850KW)
wire (flat type) 13core (CN4301) (DZ830W)
qk
wire (flat type) 5core (CN702)
ql
screw
(+BVTP 3
×
8)
w;
screw
(+BVTP 3
×
8)
wa
screw
(+B 3
×
6)
wj
MAIN board
wh
DSP board
qj
wire (flat type) 21core (CN502)
(E32, MX, SP)
wire (flat type) 21core (CN604) (E32, MX)
wire (flat type) 25core (CN603) (except E32, MX)
6
bracket (DIAT DS)
wg
two screws
(+BV 3
×
6)
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