31
31
HCD-GX750/RG551/RX550
5-7. NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
5-8. WAVEFORMS
Note on Printed Wiring Board:
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
: Pattern from the side which enables seeing.
(The other layer’s patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side)
the parts face are indicated.
C
B
These are omitted.
E
Q
B
These are omitted.
C
E
Q
B
These are omitted.
C
E
Q
Note on Schematic Diagram:
• All capacitors are in
µ
F unless otherwise noted. pF:
µµ
F
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
2
: nonflammable resistor.
•
C
: panel designation.
•
Indication of transistor.
•
A
: B+ Line.
•
B
: B– Line.
• Voltage and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : FM
(
) : CD PLAY
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: TUNER (FM/AM)
J
: CD PLAY
E
: TAPE PLAY (DECK-A)
d
: TAPE PLAY (DECK-B)
G
: REC
f
: AUDIO
• Abbreviation
MX
: Mexican model
AR
: Argentine model
E2
: 120 V AC area in E model
E3
: 240 V AC area in E model
E51
: Chilean and Peruvian model
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40
°
C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to about
350
°
C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may also
be added to ordinary solder.
Note:
The components iden-
tified by mark
0
or dot-
ted line with mark
0
are critical for safety.
Replace only with part
number specified.
Note:
Les composants identifiés
par une marque
0
sont cri-
tiques pour la sécurité.
Ne les remplacer que par
une piéce portant le numéro
spécifié.
– PANEL Board –
1
2
IC601
qh
(CF2)
IC601
qd
(I-XT2)
2V/DIV, 10
µ
s/DIV
2V/DIV, 40ns/DIV
5.2 Vp-p
30.5 s
4.9 Vp-p
100 ns
