6
TABLE OF CONTENTS
SELF-DIAGNOSIS FUNCTION
.....................................
2
1.
SERVICING NOTES
...............................................
8
2.
GENERAL
................................................................... 19
3.
DISASSEMBLY
......................................................... 23
4.
TEST MODE
............................................................... 32
5.
ELECTRICAL ADJUSTMENTS
MD Section ..................................................................... 37
CD Section ...................................................................... 48
6.
DIAGRAMS
6-1. Block Diagram – MD SERVO Section – ....................... 51
6-2. Block Diagram – D/A, A/D CONVERTER Section – ... 52
6-3. Block Diagram – MAIN Section .................................... 53
6-4. Block Diagram
– DISPLAY, POWER SUPPLY Section – ..................... 54
6-5. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 55
6-6. Printed Wiring Board – BD (CD) Board – ..................... 56
6-7. Schematic Diagram – BD (CD) Board – ........................ 57
6-8. Schematic Diagram – BD (MD) Board (1/2) – .............. 58
6-9. Schematic Diagram – BD (MD) Board (2/2) – .............. 59
6-10. Printed Wiring Board – BD (MD) Board – .................... 60
6-11. Schematic Diagram – MD DIGITAL Board (1/3) – ...... 61
6-12. Schematic Diagram – MD DIGITAL Board (2/3) – ...... 62
6-13. Schematic Diagram – MD DIGITAL Board (3/3) – ...... 63
6-14. Printed Wiring Board
– MD DIGITAL Board (Component Side) – ................. 64
6-15. Printed Wiring Boards
– MD DIGITAL (Conductor Side)/
LOADING Boards – ....................................................... 65
6-16. Schematic Diagram
– MAIN (1/2)/RDS IC Boards – ..................................... 66
6-17. Schematic Diagram – MAIN Board (2/2) – .................. 67
6-18. Printed Wiring Boards – MAIN/RDS IC Boards – ...... 68
6-19. Printed Wiring Board – SP Board – .............................. 69
6-20. Schematic Diagram – SP Board – .................................. 69
6-21. Printed Wiring Board – AMP Board – .......................... 70
6-22. Schematic Diagram – AMP Board – ............................. 71
6-23. Printed Wiring Boards – PANEL/BL Boards – ............. 72
6-24. Schematic Diagram – PANEL/BL Boards – ................ 73
6-25. Printed Wiring Board – POWER Board – ..................... 74
6-26. Schematic Diagram – POWER Board – ........................ 75
6-27. IC Pin Function Description ........................................... 81
7.
EXPLODED VIEWS
................................................ 93
8.
ELECTRICAL PARTS LIST
............................... 99
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED
LINE WITH MARK
0
ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE
0
SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE
DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ
DE FONCTIONNEMENT. NE REMPLACER CES COM-
POSANTS QUE PAR DES PIÈCES SONY DONT LES
NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
