33
33
HCD-RG100
HCD-RG100
7-8. PRINTED WIRING BOARD – MAIN SECTION –
Ref. No.
Location
D201
I-10
D211
F-4
D212
G-5
D213
G-5
D214
G-5
D215
G-4
D301
I-8
D302
I-8
D303
I-8
D304
I-8
D305
I-7
D306
I-7
D307
I-7
D308
I-7
D309
I-7
D310
I-6
D311
I-6
D312
I-6
D313
F-8
D316
G-6
D321
H-5
D322
H-5
D324
E-4
D325
E-4
D326
F-4
IC101
D-6
IC102
D-8
IC201
E-5
IC301
G-8
IC302
E-9
IC303
G-7
IC304
G-7
IC371
B-4
Q101
H-9
Q102
H-9
Q103
H-9
Q104
H-10
Q105
E-11
Q106
D-7
Q107
D-7
Q304
E-4
Q305
E-4
Q306
B-4
Q307
B-4
Q308
B-4
Q309
B-3
Q312
H-10
Q313
B-3
Q314
G-6
Q315
G-6
Q321
F-7
Q322
F-4
Q323
F-4
Q324
F-4
Q327
G-5
Q351
G-4
Q352
G-4
Q361
G-6
Q362
G-6
• Semiconductor
Location
•
: Uses unleaded solder.
• See Page 25 for Circuit Boards Location.
IC371
IC201
IC304
IC302
IC303
IC301
IC102
30
3
1
R CH
PB
HEAD
HP1
HP2
L CH
1
2
3
ERASE
HEAD
DECK-B
(REC/PLAY)
DECK-A
(PLAY)
REC/PB
HEAD
HE1
HRP2
L CH
HRP1
R CH
1
2
3
4
3
4
(CHASSIS)
(CHASSIS)
21
TUNER
10
E
E
E
E
E
E
R130
E
R122
E
E
E
E
E
E
E
E
E
E
E
E
E
1
1
9
33
6
8
1
5
11
1
E
13
1
E
E
E
E
12
1
3
1
1
2
A
B
C
D
E
F
G
H
I
J
K
3
4
5
6
7
8
9
10
11
12
13
31
E
C161
C227
C289
C290
C209
C208
C288
FB205
R254
JW306
JW307
Summary of Contents for HCD-RG100
Page 69: ...69 HCD RG100 MEMO ...