Sony HCD-RG121, Service Manual

3

HCD-RG121

TABLE OF CONTENTS

1.

SERVICE POSITION

...............................................

4

2.

GENERAL

...................................................................

6

3.

DISASSEMBLY

3-1.

Cover (Top) ...........................................................

9

3-2.

CD Door ................................................................

9

3-3.

Front Panel Section ............................................... 10

3-4.

CD Mechanism Deck (CDM74-K6BD80) ............ 10

3-5.

Tape Mechanism Deck, GAME JACK Board ....... 11

3-6.

PANEL Board ........................................................ 11

3-7.

Back Panel Section, SUB-TRANS Board ............. 12

3-8.

Power Transformer ................................................ 12

3-9.

MAIN Board ......................................................... 13

3-10. AMP Board ........................................................... 13
3-11. BD80A Board ........................................................ 14
3-12. CONNECT Board ................................................. 14
3-13. DRIVER Board, SW Board .................................. 15
3-14. Optical PICK-UP (KSM-213DCP/Z-NP) ............. 15
3-15. SENSOR Board ..................................................... 16
3-16. MOTOR (TB) Board ............................................. 16
3-17. MOTOR (LD) Board ............................................. 17

4.

TEST MODE

............................................................... 18

5.

DIAGRAMS

5-1.

Block Diagram – PANEL Section – ...................... 22

5-2.

Block Diagrams – MAIN Section – ...................... 23

5-3.

Block Diagrams – BD/DRIVER Section – ........... 24

5-4.

Printed Wiring Board – BD80A Section – ............ 25

5-5.

Schematic Diagram – BD80A Section – ............... 26

5-6.

Printed Wiring Board
– CD MECHANISM Section – ............................. 27

5-7.

Schematic Diagram
– CD MECHANISM Section – ............................. 28

5-8.

Printed Wiring Board – MAIN Section – .............. 29

5-9.

Schematic Diagram – MAIN Section (1/2) – ........ 30

5-10. Schematic Diagram – MAIN Section (2/2) – ........ 31
5-11. Printed Wiring Board

– PANEL COMB Section – ................................... 32

5-12. Schematic Diagram

– PANEL COMB Section – ................................... 33

5-13. Printed Wiring Board – PANEL Section – ............ 34
5-14. Schematic – PANEL Section (1/2) – ..................... 35
5-15. Schematic – PANEL Section (2/2) – ..................... 36
5-16. Printed Wiring Board – TRANS Section – ........... 37
5-17. Printed Wiring Board – AMP Section – ................ 38
5-18. Schematic Diagram – AMP POWER Section – .... 39
5-19. IC Pin Function Description .................................. 42

6.

EXPLODED VIEWS

6-1.

MAIN Section ....................................................... 48

6-2.

Front Panel Section ............................................... 49

6-3.

MAIN Board Section ............................................ 50

6-4.

CD Mechanism Deck Section-1
(CDM74-K6BD80) ............................................... 51

6-5.

CD Mechanism Deck Section-2
(CDM74-K6BD80) ............................................... 52

7.

ELECTRICAL PARTS LIST

.................................. 53

Unleaded solder

Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)

 : LEAD FREE MARK

Unleaded solder has the following characteristics.
•

Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!

•

Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur
such as on IC pins, etc.

•

Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.