33
33
HCD-ZX9
HCD-ZX9
• NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
Note on Printed Wiring Board:
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
: Pattern from the side which enables seeing.
(The other layer’s patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side)
the parts face are indicated.
C
B
These are omitted.
E
Q
B
These are omitted.
C
E
Q
B
These are omitted.
C
E
Q
Note on Schematic Diagram:
• All capacitors are in
µ
F unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
2
: nonflammable resistor.
•
C
: panel designation.
•
Indication of transistor.
•
A
: B+ Line.
•
B
: B– Line.
• Voltage and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : FM
<
> : CD PLAY
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: AUDIO
L
: VIDEO
f
: TUNER
E
: TAPE PLAY (DECK A)
d
: TAPE PLAY (DECK B)
G
: TAPE REC (DECK B)
J
: CD PLAY (ANALOG OUT)
c
: CD PLAY (DIGITAL OUT)
• Abbreviation
MX
: Mexican model.
Note:
The components identified by mark
0
or dotted line
with mark
0
are critical for safety.
Replace only with part number specified.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40
°
C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to about
350
°
C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may also
be added to ordinary solder.
• WAVEFORMS
— MAIN Board —
— PANEL Board —
1 V/DIV, 0.1
µ
s/DIV
1
IC401
qa
(XC-OUT)
0.5 V/DIV, 0.1
µ
s/DIV
2
IC401
qd
(X-OUT)
16MHz
0.5 Vp-p
32.768 kHz
2.8 Vp-p
1 V/DIV, 0.1
µ
s/DIV
1
IC901
is
(X OUT)
4 MHz
2.6 Vp-p
• Abbreviation
MX
: Mexican model.
Ver. 1.1
