HT-CT800
8
BOND FIXED POSITION OF ELECTRICAL PARTS
When the parts that
fi
xed on the board by the bond have been removed,
fi
x the parts by using the bond (ADHESIVE (SC608Z2)) in the
mounting to the board. (Refer to the
fi
gure below)
[ ]
: Bond application portion
– POWER Board
(Component Side) –
C914 or C915
C941
C935 or C938
C967
F931
T901
C976
C970 C977
C969
C980
T901
T901
R914
C914 or C915
D901
C905
TH901
C907 or C988
LF901
VDR901
R944
– MB-1612 Board (Side A) –
C6068
C6050
ET306
ET308
ET303
ET302
ET304
Adhesion of the
bond to this place
is prohibited.
CONTACT
TERMINAL
C902 or C989 C903 or C990
Note:
Please use the bond of low viscosity in the
bond to be used to ET302, ET303, ET304,
ET306 and ET308. These are different
from the bond to be used for other parts.
Also a contact surface (refer to left figure)
of the CONTACT TERMINAL, be careful
absolutely bond does not adhere.
MALFUNCTION PREVENTION OF THE BUTTON (TOUCH
PANEL SWITCH)
When the button portion on the top side of the main unit are
touched with something such as the
fl
oor surface, there is a pos-
sibility of occurring the malfunction.
When performing the operation check in the state that the top side
on this unit is under, set the stand etc. to the position that avoids the
button portion as shown in the
fi
gure below, perform in the state
that the button portion does not touch anything.
bottom side
stand
stand
button portion
SPREADING OF COMPOUND
When the IC6005 on the MB-1612 board or the MB-1612 board is
replaced, spread the compound to the touching portion between the
IC6005 and the heat sink.
– MB-1612 Board (Side A) –
IC6005
compound
SYS SET
2019/09/24 22:06:08 (GMT+09:00)