1-27
HXC-100/V2 (J, E)
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CN-3078 BOARD
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Ref. No.
or Q’ty Part No. SP Description
1pc A-1708-271-A s MOUNTED CIRCUIT BOARD, CN-3078
C1 1-114-236-21 s CAP, CERAMIC 22MF B (3225)
C2 1-115-339-91 s CAP, CERAMIC 0.1MF B (2012)
C3 1-115-339-91 s CAP, CERAMIC 0.1MF B (2012)
CN1 1-820-882-11 s CONNECTOR (RECEPTACLE), XLR
CN2 1-770-470-21 s PIN, CONNECTOR (PC BOARD) 6P
FB1 1-414-772-21 s FERRITE. EMI (SMD) (2012)
FB2 1-414-772-21 s FERRITE. EMI (SMD) (2012)
FB3 1-414-772-21 s FERRITE. EMI (SMD) (2012)
FB4 1-414-772-21 s FERRITE. EMI (SMD) (2012)
FB5 1-414-772-21 s FERRITE. EMI (SMD) (2012)
FB6 1-414-772-21 s FERRITE. EMI (SMD) (2012)
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DPR-298 BOARD
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Ref. No.
or Q’ty Part No. SP Description
1pc A-1707-918-A s MOUNTED CIRCUIT BOARD, DPR-298
3pcs 3-729-061-02 s SCREW (M2) (TYPE 1)
C1 1-164-842-81 s CAP,CHIP CERAMIC 2.0PF CK 1005
C2 1-164-842-81 s CAP,CHIP CERAMIC 2.0PF CK 1005
C3 1-164-842-81 s CAP,CHIP CERAMIC 2.0PF CK 1005
C4 1-164-842-81 s CAP,CHIP CERAMIC 2.0PF CK 1005
C5 1-164-842-81 s CAP,CHIP CERAMIC 2.0PF CK 1005
C6 1-164-842-81 s CAP,CHIP CERAMIC 2.0PF CK 1005
C51 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C52 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C53 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C54 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C55 1-165-875-91 s CAP, CHIP CERAMIC 10MF B 3216
C56 1-165-875-91 s CAP, CHIP CERAMIC 10MF B 3216
C57 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C59 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C60 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C61 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C62 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C63 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C64 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C65 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C66 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C69 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C70 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C71 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C72 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C73 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C74 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C80 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C82 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C83 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C84 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C85 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C86 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C87 1-165-875-91 s CAP, CHIP CERAMIC 10MF B 3216
C88 1-165-875-91 s CAP, CHIP CERAMIC 10MF B 3216
C89 1-100-881-91 s CAP, CERAMIC 47MF C (3216)
C90 1-114-548-11 s CAP, NIOBIUM ELECT 22UF
C93 1-114-548-11 s CAP, NIOBIUM ELECT 22UF
C94 1-100-881-91 s CAP, CERAMIC 47MF C (3216)
C95 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C96 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C97 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C98 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C99 1-164-936-81 s CAP, CHIP CERAMIC 680PF B 1005
C100 1-112-692-81 s CAP,CHIP CERAMIC1000PF CH 1005
C101 1-112-692-81 s CAP,CHIP CERAMIC1000PF CH 1005
C102 1-164-866-81 s CAP, CHIP CERAMIC 47PF CH 1005
C103 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C104 1-164-866-81 s CAP, CHIP CERAMIC 47PF CH 1005
C105 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C106 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C107 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C108 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C110 1-114-214-81 s CAP,CHIP CERAMIC470PF CH1005
C111 1-164-845-81 s CAP, CHIP CERAMIC 5PF CH 1005
C112 1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
Summary of Contents for HXC-100
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