1-28
HXC-100/V2 (J, E)
(DPR-298 BOARD)
Ref. No.
or Q’ty Part No. SP Description
C113 1-164-866-81 s CAP, CHIP CERAMIC 47PF CH 1005
C114 1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C115 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C116 1-165-875-91 s CAP, CHIP CERAMIC 10MF B 3216
C118 1-165-875-91 s CAP, CHIP CERAMIC 10MF B 3216
C119 1-165-875-91 s CAP, CHIP CERAMIC 10MF B 3216
C120 1-165-875-91 s CAP, CHIP CERAMIC 10MF B 3216
C122 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C123 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C124 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C125 1-164-936-81 s CAP, CHIP CERAMIC 680PF B 1005
C126 1-164-936-81 s CAP, CHIP CERAMIC 680PF B 1005
C127 1-164-936-81 s CAP, CHIP CERAMIC 680PF B 1005
C128 1-165-875-91 s CAP, CHIP CERAMIC 10MF B 3216
C129 1-165-875-91 s CAP, CHIP CERAMIC 10MF B 3216
C130 1-165-875-91 s CAP, CHIP CERAMIC 10MF B 3216
C131 1-100-881-91 s CAP, CERAMIC 47MF C (3216)
C132 1-100-881-91 s CAP, CERAMIC 47MF C (3216)
C133 1-100-881-91 s CAP, CERAMIC 47MF C (3216)
C135 1-100-881-91 s CAP, CERAMIC 47MF C (3216)
C137 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C138 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C139 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C140 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C141 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C142 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C143 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C144 1-114-548-11 s CAP, NIOBIUM ELECT 22UF
C145 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C146 1-114-548-11 s CAP, NIOBIUM ELECT 22UF
C147 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C148 1-114-548-11 s CAP, NIOBIUM ELECT 22UF
C149 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C150 1-114-548-11 s CAP, NIOBIUM ELECT 22UF
C151 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C154 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C162 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C163 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C164 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C166 1-114-548-11 s CAP, NIOBIUM ELECT 22UF
C170 1-114-214-81 s CAP,CHIP CERAMIC470PF CH1005
C171 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C172 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C173 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C174 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C175 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C176 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C177 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C178 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C181 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C182 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C183 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C184 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C185 1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C186 1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C187 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C188 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C189 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C190 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
(DPR-298 BOARD)
Ref. No.
or Q’ty Part No. SP Description
C191 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C192 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C193 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C194 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C195 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C196 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C197 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C198 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C199 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C201 1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C202 1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C203 1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C204 1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C205 1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C206 1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C207 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C208 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C209 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C210 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C211 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C212 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C213 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C214 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C215 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C216 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C217 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C218 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C219 1-164-845-81 s CAP, CHIP CERAMIC 5PF CH 1005
C220 1-164-845-81 s CAP, CHIP CERAMIC 5PF CH 1005
C221 1-164-845-81 s CAP, CHIP CERAMIC 5PF CH 1005
C222 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C223 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C224 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C225 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C226 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C227 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C228 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C229 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C230 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C231 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C232 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C233 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C234 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C235 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C236 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C237 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C238 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C239 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C240 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C241 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C242 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C243 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C244 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C245 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C246 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C247 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C248 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C249 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C250 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
Summary of Contents for HXC-100
Page 1: ...HD COLOR CAMERA HXC 100 SERVICE MANUAL Volume 2 1st Edition ...
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