1-31
HXC-100/V2 (J, E)
(DPR-298 BOARD)
Ref. No.
or Q’ty Part No. SP Description
C754 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C755 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C756 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C757 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C758 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C759 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C760 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C761 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C762 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C763 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C764 1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C765 1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C766 1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C767 1-164-843-81 s CAP, CHIP CERAMIC 3PF CJ 1005
C768 1-164-845-81 s CAP, CHIP CERAMIC 5PF CH 1005
C769 1-164-843-81 s CAP, CHIP CERAMIC 3PF CJ 1005
C770 1-164-845-81 s CAP, CHIP CERAMIC 5PF CH 1005
C771 1-164-843-81 s CAP, CHIP CERAMIC 3PF CJ 1005
C772 1-164-845-81 s CAP, CHIP CERAMIC 5PF CH 1005
C773 1-164-852-81 s CAP, CHIP CERAMIC 12PF CH 1005
C774 1-164-852-81 s CAP, CHIP CERAMIC 12PF CH 1005
C775 1-164-852-81 s CAP, CHIP CERAMIC 12PF CH 1005
C776 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C777 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C778 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C779 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C780 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C781 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C782 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C783 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C784 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C785 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C786 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C787 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C788 1-164-845-81 s CAP, CHIP CERAMIC 5PF CH 1005
C789 1-164-845-81 s CAP, CHIP CERAMIC 5PF CH 1005
C790 1-164-845-81 s CAP, CHIP CERAMIC 5PF CH 1005
C792 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C793 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C794 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C795 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C796 1-100-881-91 s CAP, CERAMIC 47MF C (3216)
C797 1-100-881-91 s CAP, CERAMIC 47MF C (3216)
C798 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C799 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C800 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C801 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C802 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C803 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C804 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C805 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C806 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C807 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C808 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C809 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C810 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C811 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C812 1-164-866-81 s CAP, CHIP CERAMIC 47PF CH 1005
C813 1-164-858-81 s CAP, CHIP CERAMIC 22PF CH 1005
(DPR-298 BOARD)
Ref. No.
or Q’ty Part No. SP Description
C814 1-164-845-81 s CAP, CHIP CERAMIC 5PF CH 1005
C815 1-164-866-81 s CAP, CHIP CERAMIC 47PF CH 1005
C816 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C817 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C818 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C819 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C820 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C821 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C822 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C823 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C824 1-164-854-81 s CAP, CHIP CERAMIC 15PF CH 1005
C826 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C827 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C828 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C829 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C830 1-100-881-91 s CAP, CERAMIC 47MF C (3216)
C831 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C832 1-114-548-11 s CAP, NIOBIUM ELECT 22UF
C833 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C834 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C836 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C837 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C838 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C839 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C840 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C841 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C845 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C847 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C849 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C850 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C859 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C864 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C868 1-112-300-91 s CAP, CERAMIC 4.7MF B (2012)
C869 1-112-300-91 s CAP, CERAMIC 4.7MF B (2012)
C870 1-114-548-11 s CAP, NIOBIUM ELECT 22UF
C871 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C872 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C873 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C874 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C875 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C876 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C877 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C878 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C879 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C903 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C904 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C905 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C906 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C907 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C908 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C909 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C910 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C911 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C912 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C913 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C914 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C915 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C916 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C917 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
Summary of Contents for HXC-100
Page 1: ...HD COLOR CAMERA HXC 100 SERVICE MANUAL Volume 2 1st Edition ...
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Page 97: ...2 1 HXC 100 V2 J E 2 1 Section 2 Block Diagrams ...
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