2
ICD-SX25/SX25VTP
TABLE OF CONTENTS
1.
GENERAL
...................................................................
3
2.
DISASSEMBLY
2-1.
Disassembly Flow ...........................................................
4
2-2.
Cover (jack) .....................................................................
4
2-3.
Case Block Assy ..............................................................
5
2-4.
AUDIO Board, Microphone Unit (MIC2/3) ....................
5
2-5.
Ornament Belt, SW Board ...............................................
6
2-6.
Cover (chassis) Block Assy .............................................
6
2-7.
MAIN Board, Liquid Crystal Display Panel ...................
7
3.
TEST MODE
...............................................................
8
4.
DIAGRAMS
4-1.
Block Diagrams – MAIN Section-1 – ............................ 12
4-2.
Block Diagrams – MAIN Section-2 – ............................ 13
4-3.
Block Diagrams – PANEL Section – ............................. 14
4-4.
Printed Wiring Board – MAIN Board – ......................... 15
4-5.
Schematic Diagram – MAIN Board (1/2) – ................... 16
4-6.
Schematic Diagram – MAIN Board (2/2) – ................... 17
4-7.
Printed Wiring Board – AUDIO Board – ....................... 18
4-8.
Schematic Diagram – AUDIO Board (1/2) – ................. 19
4-9.
Schematic Diagram – AUDIO Board (2/2) – ................. 20
4-10. Printed Wiring Board – SW Board – .............................. 21
4-11. Schematic Diagram – SW Board – ................................. 22
5.
EXPLODED VIEWS
5-1.
Case Block Assy .............................................................. 30
5-2.
Chassis Block Assy ......................................................... 31
6.
ELECTRICAL PARTS LIST
.................................. 32
Flexible Circuit Board Repairing
•
Keep the temperature of the soldering iron around 270
°
C
during repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
✩
Replacement of IC6001 and IC7003 used in this set requires
a special tool.
•
The voltage and waveform of CSP (chip size package) cannot
be measured, because its lead layout is different from that of
conventional IC.
•
Lead layouts
surface
Lead layout of
conventional IC
CSP (chip size package)
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•
Unleaded solder melts at a temperature about 40
°
C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°
C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•
Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder. Operating instructiondd
Summary of Contents for ICD-SX25 - Icd Recorder
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