ICD-SX68/SX68DR9/SX78/SX78DR9/SX88
2
1. GENERAL
.................................................................. 3
2. DISASSEMBLY
2-1. Knob (HOLD), Speaker Assy (SP001) ........................... 6
2-2. Chassis Assy, Case Assy ................................................. 6
2-3. Battery Case Lid ............................................................. 7
2-4. Cover (Chassis), MAIN Board ....................................... 7
2-5. Chassis
............................................................................ 8
2-6. SW Board, HPJACK Board ............................................ 8
2-7. MIC-A Assy, MIC-B Assy .............................................. 9
2-8. Liquid Crystal Display Panel, AUDIO Board ................ 9
3.
TEST MODE
............................................................ 10
4. DIAGRAMS
4-1. Block Diagram - MAIN1 Section - ................................ 13
4-2. Block Diagram - MAIN2 Section - ................................ 14
4-3. Printed Wiring Board - AUDIO Board (Side A) - ......... 15
4-4. Printed Wiring Board - AUDIO Board (Side B) - ......... 16
4-5. Schematic Diagram - AUDIO Board (1/2) - .................. 17
4-6. Schematic Diagram - AUDIO Board (2/2) - .................. 18
4-7. Printed Wiring Board - MAIN Board (Side A) - ........... 19
4-8. Printed Wiring Board - MAIN Board (Side B) - ........... 20
4-9. Schematic Diagram - MAIN Board (1/5) - .................... 21
4-10. Schematic Diagram - MAIN Board (2/5) - .................... 22
4-11. Schematic Diagram - MAIN Board (3/5) - .................... 23
4-12. Schematic Diagram - MAIN Board (4/5) - .................... 24
4-13. Schematic Diagram - MAIN Board (5/5) - .................... 25
4-14. Printed Wiring Boards - HPJACK Board, SW Board - . 26
4-15. Schematic Diagram - HPJACK Board, SW Board - ...... 27
5.
EXPLODED VIEWS
5-1. Overall
Assy
.................................................................... 38
5-2. Chassis
Section
............................................................... 39
6.
ELECTRICAL PARTS LIST
.............................. 40
TABLE OF CONTENTS
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
•
Keep the temperature of soldering iron around 270 °C during
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.
