– 2 –
Specifications ............................................................................ 1
1. SERVICE NOTE
........................................................... 3
2. GENERAL
...................................................................... 4
3. DISASSEMBLY
3-1. Cabinet (Lower), Cabinet ASSY .............................. 25
3-2. Chassis ASSY ........................................................... 26
3-3. Main Board ............................................................... 26
3-4. Key Board ................................................................. 27
3-5. Microcomputer Board ............................................... 27
3-6. Cabinet (Front), Reel ASSY ..................................... 28
3-7. Cabinet (Rear), Reel Board, Control Board ............. 28
4. ELECTRICAL ADJUSTMENTS
........................
29
5. DIAGRAMS
5-1. Explanation of IC Terminals ................................... 34
5-2. Block Diagrams ....................................................... 37
5-3. Printed Wiring Boards (Main Section) .................... 41
5-4. Schematic Diagram (Main Section) ........................ 46
5-5. Printed Wiring Boards (Key Section) ..................... 50
5-6. Schematic Diagram (Key Section) .......................... 53
5-7. Printed Wiring Boards (Microcomputer Section) ... 55
5-8. Schematic Diagram (Microcomputer Section) ....... 56
5-9. Printed Wiring Boards (Antenna Section) .............. 59
5-10. Schematic Diagram (Antenna Section) ................... 61
6. EXPLODED VIEWS
6-1. Cabinet Section ......................................................... 64
6-2. Chassis Section ......................................................... 65
6-3. Antenna Controller Section ...................................... 66
6-4. SW Loop Antenna Section ....................................... 67
7. ELECTRICAL PARTS LIST
................................... 68
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE
!
SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES
SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT.
NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES
SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL
OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
!
OR DOTTED LINE WITH
MARK
!
ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270°C during
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
TABLE OF CONTENTS
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