6-8
VPL-S900E, VPL-S900M, VPL-S900U
Rf.NO.
PART NO.
DESCRIPTION
REMARK
Rf.NO.
PART NO.
DESCRIPTION
REMARK
BB
R2836
1-216-017-91 RES,CHIP
47
5%
1/10W
R2837
1-216-073-00 RES,CHIP
10K
5%
1/10W
R2838
1-216-013-00 RES,CHIP
33
5%
1/10W
R2839
1-216-089-91 RES,CHIP
47K
5%
1/10W
R2840
1-216-097-91 RES,CHIP
100K
5%
1/10W
R2841
1-216-017-91 RES,CHIP
47
5%
1/10W
R2842
1-216-025-91 RES,CHIP
100
5%
1/10W
R2843
1-216-073-00 RES,CHIP
10K
5%
1/10W
R2845
1-216-049-91 RES,CHIP
1K
5%
1/10W
R2846
1-216-013-00 RES,CHIP
33
5%
1/10W
R2847
1-216-097-91 RES,CHIP
100K
5%
1/10W
R2848
1-216-089-91 RES,CHIP
47K
5%
1/10W
R2850
1-216-186-00 RES,CHIP
330
5%
1/8W
R2851
1-216-186-00 RES,CHIP
330
5%
1/8W
<RELAY>
RY2801
1-755-297-21 RELAY
RY2802
1-755-297-21 RELAY
RY2803
1-755-297-21 RELAY
*****************************************************************
1-475-689-61 BB BOARD, COMPLETE
(CONVERTER UNIT, SCAN (BB))
******************************
<CAPACITOR>
C3006
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3008
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3009
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3010
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3011
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3012
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3018
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3019
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3020
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3021
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3023
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3024
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3025
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3026
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3027
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3028
1-110-501-11 CERAMIC CHIP0.33
µ
F
10% 16V
C3029
1-162-927-11 CERAMIC CHIP100PF
5%
50V
C3030
1-164-730-11 CERAMIC CHIP0.0012
µ
F
10% 50V
C3031
1-164-505-11 CERAMIC CHIP2.2
µ
F
16V
C3032
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3033
1-107-498-11 FILM
0.0022
µ
F
2%
50V
C3034
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3035
1-164-505-11 CERAMIC CHIP2.2
µ
F
16V
C3036
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3044
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3046
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3047
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3049
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3051
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3052
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3053
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3054
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3056
1-164-505-11 CERAMIC CHIP2.2
µ
F
16V
C3057
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3059
1-107-498-11 FILM
0.0022
µ
F
2%
50V
C3060
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3061
1-164-505-11 CERAMIC CHIP2.2
µ
F
16V
C3062
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3063
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3064
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3065
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3066
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3068
1-164-505-11 CERAMIC CHIP2.2
µ
F
16V
C3069
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3071
1-107-498-11 FILM
0.0022
µ
F
2%
50V
C3072
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3073
1-164-505-11 CERAMIC CHIP2.2
µ
F
16V
C3074
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3075
1-126-204-21 ELECT
47
µ
F
16V
C3076
1-126-204-21 ELECT
47
µ
F
16V
C3077
1-126-204-21 ELECT
47
µ
F
16V
C3078
1-115-156-11 CERAMIC CHIP1
µ
F
10V
C3079
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3080
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3081
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3084
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3086
1-115-156-11 CERAMIC CHIP1
µ
F
10V
C3087
1-115-156-11 CERAMIC CHIP1
µ
F
10V
C3088
1-115-156-11 CERAMIC CHIP1
µ
F
10V
C3089
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3090
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3091
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3092
1-162-921-11 CERAMIC CHIP33PF
5%
50V
C3093
1-162-970-11 CERAMIC CHIP0.01
µ
F
10% 25V
C3094
1-126-204-21 ELECT
47
µ
F
16V
C3095
1-126-204-21 ELECT
47
µ
F
16V
C3096
1-126-204-21 ELECT
47
µ
F
16V
C3098
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3099
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3100
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3101
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3103
1-115-156-11 CERAMIC CHIP1
µ
F
10V
C3104
1-115-156-11 CERAMIC CHIP1
µ
F
10V
C3105
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3106
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3107
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3109
1-126-204-21 ELECT
47
µ
F
16V
C3110
1-126-204-21 ELECT
47
µ
F
16V
C3114
1-115-156-11 CERAMIC CHIP1
µ
F
10V
C3115
1-115-156-11 CERAMIC CHIP1
µ
F
10V
C3116
1-115-156-11 CERAMIC CHIP1
µ
F
10V
C3117
1-115-156-11 CERAMIC CHIP1
µ
F
10V
C3118
1-115-156-11 CERAMIC CHIP1
µ
F
10V
C3119
1-115-156-11 CERAMIC CHIP1
µ
F
10V
C3121
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3122
1-164-156-11 CERAMIC CHIP0.1
µ
F
25V
C3123
1-115-156-11 CERAMIC CHIP1
µ
F
10V
BAA
Summary of Contents for IFB-X600E
Page 5: ...5 VPL S900E VPL S900M VPL S900U F Board 8 24 GA Board 8 24 GB Board 8 26 GBA Board 8 28 ...
Page 6: ......
Page 47: ...1 41 VPL S900E VPL S900M VPL S900U ...
Page 48: ...1 42 VPL S900E VPL S900M VPL S900U ...
Page 49: ...1 43 VPL S900E VPL S900M VPL S900U ...
Page 50: ...1 44 VPL S900E VPL S900M VPL S900U ...
Page 51: ...1 45 VPL S900E VPL S900M VPL S900U ...
Page 52: ...1 46 VPL S900E VPL S900M VPL S900U ...
Page 53: ...1 47 VPL S900E VPL S900M VPL S900U ...
Page 54: ...1 48 VPL S900E VPL S900M VPL S900U ...
Page 55: ...1 49 VPL S900E VPL S900M VPL S900U ...
Page 56: ......
Page 62: ......
Page 70: ......
Page 78: ......
Page 144: ......