4
4
MZ-E501
2-2. PRINTED WIRING BOARD – MAIN SECTION (SIDE A) –
1
2
A
B
C
D
E
F
G
H
I
3
4
5
6
7
8
9
10
11
12
13
14
1-681-868-
12
(12)
IC 501
IC 601
IC 301
IC 901
15
6
7
10
12
13
15
18
19
24
C301
S806
GROUP
S804
VOL-
S808
HOLD
OFF
ON
S805
VOL+
S801
S803
S802
DRY BATTERY
SIZE "AA"
(IEC DESIGNATION LR6)
1PC, 1.5V
(INFO)
E
CSP (Chip Size Package)
MAIN BOARD
(SIDE A)
*
E
Ref. No.
Location
D101
C-13
D201
C-13
D801
G-10
D855
E-13
D902
H-13
D903
G-14
IC301
B-12
IC501
H-5
IC601
C-6
IC901
G-12
Q301
B-11
Q501
H-3
Q901
G-11
Q902
F-11
Q903
F-11
• Semiconductor
Location
Note on Printed Wiring Boards
•
X
: parts extracted from the component side.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from the
(Side B)
pattern face are indicated.
Parts face side:
Parts on the parts face side seen from the
(Side A)
parts face are indicated.
• Main boards is four-layer pritnted board.
However, the patterns of layer 2 and 3 have not been
included in this diagrams.
•
Lead Layouts
Lead layout of
conventional IC
surface
CSP (chip size package)
*
Replacement of IC601 used in this set requires a special tool.
Summary of Contents for MZ-E501
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