Sony MZ-E80, Service Manual

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TABLE  OF  CONTENTS

1.

SERVICING  NOTES

...............................................

2

2.

GENERAL

...................................................................

3

3.

DISASSEMBLY

.........................................................

4

4.

TEST  MODE

..............................................................

6

5.

ELECTRICAL  ADJUSTMENTS

......................... 10

6.

DIAGRAMS

6-1. Block Diagram ................................................................ 11
6-2. Printed Wiring Boards .................................................... 16
6-3. Schematic Diagram ......................................................... 19
6-4. IC Pin Function Description ........................................... 28

7.

EXPLODED  VIEWS

................................................ 35

8.

ELECTRICAL  PARTS  LIST

............................... 37

Flexible Circuit Board Repairing

• Keep the temperature of the soldering iron around 270 ˚C dur-

ing repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

Notes on chip component replacement

• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

SAFETY-RELATED  COMPONENT  WARNING!!

COMPONENTS  IDENTIFIED  BY  MARK  

!

  OR  DOTTED

LINE  WITH  MARK  

!

  ON  THE  SCHEMATIC  DIAGRAMS

AND  IN  THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE
OPERATION.  REPLACE  THESE  COMPONENTS  WITH
SONY  PARTS  WHOSE  PART  NUMBERS  APPEAR  AS
SHOWN  IN  THIS  MANUAL  OR  IN  SUPPLEMENTS  PUB-
LISHED  BY  SONY.

CAUTION

Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.

SECTION  1

SERVICING  NOTES

This MiniDisc player is classified as a CLASS 1
LASER product.
The CLASS 1 LASER PRODUCT label is located
on the bottom exterior.

• Removing the mechanism deck causes this set to be disabled

during a repair with the power supplied to the set. Therefore,
lock convex portion of open/close detect switch (S801) during
a repair.

• Replacement of CXD2663GA (IC601) used in this set requires

a special tool. Therefore, it cannot be replaced.

Mechanism deck section

Open/close detect 
switch (S801)