Sony SCD-CE595, Service Manual

2

SCD-CE595

Notes on chip component replacement

•

Never reuse a disconnected chip component.

•

Notice that the minus side of a tantalum capacitor may be
damaged by heat.

Flexible Circuit Board Repairing

•

Keep the temperature of the soldering iron around 270 

°

C

during repairing.

•

Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).

•

Be careful not to apply force on the conductor when soldering
or unsoldering.

CAUTION

Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.

This appliance is 
classified as a CLASS 1 
LASER product. This 
label is located on the 
rear exterior.

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

NOTES  ON  LASER  DIODE  EMISSION  CHECK

The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

NOTES  ON  HANDLING  THE  OPTICAL  PICK-UP
BLOCK  OR  BASE  UNIT

LASER  DIODE  AND  FOCUS  SEARCH  OPERATION
CHECK

Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveform is output three times.

TABLE OF CONTENTS

1.

SERVICING NOTES

...........................................

3

2.

GENERAL

............................................................

4

3.

TEST MODE

.........................................................

6

4.

DIAGRAMS

4-1.

Block Diagram ................................................................

8

4-2.

Printed Wiring Board — RF Section — .........................

9

4-3.

Schematic Diagram — RF Section — ........................... 10

4-4.

Printed Wiring Board — MAIN Section — ................... 11

4-5.

Schematic Diagram — MAIN Section (1/4)  — ............ 12

4-6.

Schematic Diagram — MAIN Section (2/4)  — ............ 13

4-7.

Schematic Diagram — MAIN Section (3/4)  — ............ 14

4-8.

Schematic Diagram — MAIN Section (4/4)  — ............ 15

4-9.

Printed Wiring Board — DISPLAY Section  — ............ 16

4-10. Schematic Diagram — DISPLAY Section — ................ 17
4-11. Printed Wiring Board — MD-94 Board Section  — ...... 18
4-12. Schematic Diagram — MD-94 Board Section — .......... 19

5.

EXPLODED VIEWS

5-1.

Main Section .................................................................... 22

5-2.

Front Panel Section ......................................................... 23

5-3.

Chassis Section ................................................................ 24

5-4.

CD Mechanism Section (1) (CDM79C-DVBU51) ......... 25

5-5.

CD Mechanism Section (2) (CDM79C-DVBU51) ......... 26

6.

ELECTRICAL  PARTS  LIST

............................

27

SAFETY-RELATED  COMPONENT  WARNING!!

COMPONENTS  IDENTIFIED  BY  MARK  

0

  OR  DOTTED  LINE

WITH  MARK  

0

  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN

THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS  WHOSE
PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  MANUAL  OR
IN  SUPPLEMENTS  PUBLISHED  BY  SONY.

ATTENTION  AU  COMPOSANT  AYANT  RAPPORT

À  LA  SÉCURITÉ!

LES  COMPOSANTS  IDENTIFIÉS  PAR  UNE  MARQUE  

0

 SUR

LES  DIAGRAMMES  SCHÉMATIQUES  ET  LA  LISTE  DES
PIÈCES  SONT  CRITIQUES  POUR  LA  SÉCURITÉ  DE
FONCTIONNEMENT.  NE  REMPLACER  CES  COM-  POSANTS
QUE  PAR  DES  PIÈCES  SONY  DONT  LES  NUMÉROS  SONT
DONNÉS  DANS  CE  MANUEL  OU  DANS  LES  SUPPLÉMENTS
PUBLIÉS  PAR  SONY.