11
11
SCD-XE597
SCD-XE597
SECTION 4
DIAGRAMS
• Circuit Boards Location
NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
Note on Printed Wiring Board:
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
W
: indicates side identified with part number.
•
f
: internal component.
•
: Pattern from the side which enables seeing.
C
B
These are omitted.
E
Q
Note Schematic Diagrams.
• All capacitors are in
µ
F unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
f
: internal component.
•
C
: panel designation.
•
A
: B+ Line.
•
B
: B– Line.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark: SACD PLAY
( ) : CD PLAY
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
J
: CD
c
: CD DIGITAL OUT (OPTICAL)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Side B) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Side A) the parts face are indicated.
Note: The components identified by mark
0
or dotted
line with mark
0
are critical for safety.
Replace only with part number specified.
MAIN board
RF board
DISPLAY board
LOADING board
PT board
KEY board
LED board
POWER SW board
1.4 Vp-p
1
IC001
tl
SIGO (CD)
1.4 Vp-p
1
IC001
tl
SIGO (SACD)
4
IC320
2
,
4
,
6
,
q;
,
qs
1.4 Vp-p
3
IC706
<z./
RF IN (SACD)
2
IC706
uk
DSPHREFO
354 ns
3.5 Vp-p
5
IC801
5
IC
200 ns
3.5 Vp-p
200 ns/DIV
40 ns/DIV
40 ns/DIV
3.3 Vp-p
88.6 ns
• Waveforms
• Indication of transistor.
– RF Board –
– MAIN Board –
– DISPLAY Board –