2
SCD-XE597
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
•
Keep the temperature of the soldering iron around 270
°
C
during repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
This appliance is
classified as a CLASS 1
LASER product. This
label is located on the
rear exterior.
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveform is output three times.
TABLE OF CONTENTS
1.
SERVICING NOTES
................................................ 3
2.
GENERAL
................................................................... 4
3.
DISASSEMBLY
3-1.
Disassembly Flow ........................................................... 6
3-2.
Cover ............................................................................... 6
3-3.
MAIN Board .................................................................... 7
3-4.
Loading Panel .................................................................. 7
3-5.
Front Panel Section ......................................................... 8
3-6.
KEY Board, DISPLAY Board ......................................... 8
3-7.
CD Mechanism Deck (CDM66D-DVBU50) .................. 9
3-8.
Base Unit (DVBU50) ...................................................... 9
3-9.
RF Board, Pick-up Unit (DBU-3) ................................... 10
3-10. Belt (LD), LOADING Board, Motor (L) Assy ................ 10
4.
DIAGRAMS
4-1.
Block Diagram ................................................................ 12
4-2.
Printed Wiring Board — RF Section — ......................... 13
4-3.
Schematic Diagram — RF Section — ........................... 14
4-4.
Printed Wiring Board — MAIN Section — ................... 15
4-5.
Schematic Diagram — MAIN Section (1/4) — ............ 16
4-6.
Schematic Diagram — MAIN Section (2/4) — ............ 17
4-7.
Schematic Diagram — MAIN Section (3/4) — ............ 18
4-8.
Schematic Diagram — MAIN Section (4/4) — ............ 19
4-9.
Printed Wiring Board — DISPLAY Section — ............ 20
4-10. Schematic Diagram — DISPLAY Section — ................ 21
5.
TEST MODE
............................................................... 22
6.
EXPLODED VIEWS
6-1.
Main Section .................................................................... 23
6-2.
Front Panel Section ......................................................... 24
6-3.
CD Mechanism Deck ...................................................... 25
6-4.
Base Unit (DVBU50) ...................................................... 26
7.
ELECTRICAL PARTS LIST
................................ 27
