2
SCD-XE600
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
•
Keep the temperature of the soldering iron around 270 ˚C
during repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
This appliance is classified as a CLASS 1
LASER product.
This label is located on the rear exterior.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
TABLE OF CONTENTS
1. SERVICING NOTES
......................................................... 3
2. GENERAL
............................................................................ 4
3. DISASSEMBLY
3-1.
Disassembly Flow .............................................................. 6
3-2.
Case (408226) ..................................................................... 6
3-3.
Main Board ......................................................................... 7
3-4.
Panel Loading ..................................................................... 7
3-5.
Front Panel Block ............................................................... 8
3-6.
CD Mechanism Deck (CDM66D-DVBU50) ..................... 8
3-7.
Base Unit (DVBU50) ......................................................... 9
3-8.
RF Board, Optical Traverse Unit ........................................ 9
3-9.
Loading Board, Motor (L) Assy (Loading) (M151) ......... 10
4. TEST MODE
...................................................................... 11
5. DIAGRAMS
5-1.
Block Diagram ................................................................. 12
5-2.
Printed Wiring Board – RF Board – ................................. 14
5-3.
Schematic Diagram – RF Board – .................................... 15
5-4.
Printed Wiring Boards – MAIN Board – .......................... 16
5-5.
Schematic Diagram – MAIN Board (1/4) – ..................... 17
5-6.
Schematic Diagram – MAIN Board (2/4) – ..................... 18
5-7.
Schematic Diagram – MAIN Board (3/4) – ..................... 19
5-8.
Schematic Diagram – MAIN Board (4/4) – ..................... 20
5-9.
Printed Wiring Boards
– Display, Power Supply Section – .................................. 21
5-10. Schematic Diagram
– Display, Power Supply Section – .................................. 22
6. EXPLODED VIEWS
6-1.
Main Section ..................................................................... 28
6-2.
Front Panel Section .......................................................... 29
6-3.
CD Mechanism Deck Section
(CDM66D-DVBU50) ....................................................... 30
6-4.
Base Unit Section (DVBU50) .......................................... 31
7. ELECTRICAL PARTS LIST
......................................... 32
