– 2 –
TABLE OF CONTENTS
1.
GENERAL
Identifying the Parts ........................................................
3
Setting Up the Base Phone .............................................
3
Preparing the Battery Pack .............................................
4
Making Calls ...................................................................
5
Receiving Calls ...............................................................
5
Telephone Features .........................................................
6
2.
DISASSEMBLY
.........................................................
9
3.
TEST MODE
Base Unit ......................................................................... 12
Handset ............................................................................ 14
4.
ELECTRICAL ADJUSTMENTS
Base Unit ......................................................................... 15
Handset ............................................................................ 17
5.
DIAGRAMS
5-1. Block Diagram – BASE UNIT Section (1/2) – ............. 19
5-2. Block Diagram – BASE UNIT Section (2/2) – ............. 21
5-3. Block Diagram – HANDSET Section – ........................ 23
5-4. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 25
5-5. Printed Wiring Board – BASE RF Section – ................ 26
5-6. Schematic Diagram – BASE RF Section – ................... 27
5-7. Printed Wiring Boards – BASE MAIN Section – ......... 29
5-8. Schematic Diagram – BASE MAIN Section – ............. 31
5-9. Printed Wiring Board – BASE KEY Section – ............. 34
5-10. Schematic Diagram – BASE KEY Section – ................ 35
5-11. Printed Wiring Board – HAND RF Section – ............... 36
5-12. Schematic Diagram – HAND RF Section – .................. 37
5-13. Printed Wiring Board – HAND MAIN Section – ........ 39
5-14. Schematic Diagram – HAND MAIN Section – ............ 41
5-15. IC Pin Function Description ........................................... 45
6.
EXPLODED VIEWS
................................................ 47
7.
ELECTRICAL PARTS LIST
............................... 49
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED
LINE WITH MARK
0
ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE
0
SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE
DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ
DE FONCTIONNEMENT. NE REMPLACER CES COM-
POSANTS QUE PAR DES PIÈCES SONY DONT LES
NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
Summary of Contents for SPP-933 - 900mhz Cordless Telephone
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