– 2 –
TABLE OF CONTENTS
1.
GENERAL
Identifying the Parts ........................................................
3
Setting Up the Base Phone .............................................
4
Preparing the Battery Pack .............................................
5
Entering the Area code ....................................................
5
Making Calls ...................................................................
6
Receiving Calls ...............................................................
8
Telephone Features .........................................................
9
Caller ID Features ........................................................... 13
2.
DISASSEMBLY
......................................................... 17
3.
ELECTRICAL ADJUSTMENTS
Base Unit ......................................................................... 20
Handset ............................................................................ 21
4.
DIAGRAMS
4-1. Block Diagram – MAIN Section – ................................ 23
4-2. Block Diagram – DISPLAY/
KEY SHIFT/POWER SUPPLY Section – ..................... 25
4-3. Block Diagram – HANDSET Section – ........................ 27
4-4. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 29
4-5. Printed Wiring Board
– BASE MAIN Board (Component Side) – ................... 31
4-6. Printed Wiring Board
– BASE MAIN Board (Conductor Side) – ..................... 33
4-7. Schematic Diagram – BASE MAIN Board (1/3) – ....... 35
4-8. Schematic Diagram – BASE MAIN Board (2/3) – ....... 37
4-9. Schematic Diagram – BASE MAIN Board (3/3) – ....... 39
4-10. Printed Wiring Board – BASE KEY Board – ............... 41
4-11. Schematic Diagram – BASE KEY Board – .................. 42
4-12. Printed Wiring Board – HAND MAIN Board – .......... 43
4-13. Schematic Diagram – HAND MAIN Board – .............. 45
5.
EXPLODED VIEWS
................................................ 50
6.
ELECTRICAL PARTS LIST
............................... 52
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED
LINE WITH MARK
0
ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
NOTE FOR REPLACEMENT OF THE EEPROM
The ID cord is written in the EEPROM.
When replacing the EEPROM, U1011 on the BASE MAIN board
and U1006 on HAND MAIN board should be replaced together as
a pair.
Summary of Contents for SPP-IM977
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