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SRS-T70

– 5 –

– 6 –

SECTION  3

DIAGRAMS

3-1.

BLOCK  DIAGRAM

AMP  BOARD,  JACK  BOARD

PRECAUTION  ON  ROUTING  THE  LEAD  WIRES

05

 SIGNAL PATH

: LINE INPUT

S1 (1/4)

S1 (2/4)

S1 (3/4)

S1 (4/4)

B+

SP1

(L-CH)

SP2

(R-CH)

P1

(LINE INPUT)

POWER AMP

IC1

OUT1

IN1+

POWER

AMP

19

12

OUT2

IN2+

POWER

AMP

MUTING

Q1

MUTING

Q2

2

9

POWER AMP

IC2

OUT1

IN1+

POWER

AMP

19

12

OUT2

IN2+

POWER

AMP

2

9

+

+

JK1

DC IN 9V

!

DRY BATTERY

SIZE “AA”

(IEC DESIGNATION R6)

4PCS. 6V

D2

POWER

S1

POWER

OFF/DIRECT

ON

switch knob

S1

Note: When mounting the AMP board,

align the position of switch (S1) 
and the switch knob.

3

AMP board

2

two screws
(P2 

×

 5)

1

Remove four solders 
of speaker unit 
(SP1/SP2) leads.

1

Remove three solders 
of cord (with plug).

1

Disconnect three soldered lead wire,
two (yellow, brown) from the JACK board 
and one (red) from plus battery spring.
(For the colors of lead wires and 
“PRECAUTION ON ROUTING THE LEAD WIRES”,
see the following figure.)

2

two screws
(P2 

×

 5)

3

JACK board

1

Disconnect three solders lead wire, 
two (yellow, brown) from the AMP board 
and one (black) from minus battery spring.
(For the colors of lead wires and
“PRECAUTION ON ROUTING THE LEAD WIRES”,
see the following figure.)

AMP board

GRN

NATURAL

RED

WHT

NATURAL

RED

BLK

lead wire
(speaker unit (SP2)
(R ch) 

y

 AMP board)

lead wire
(speaker unit 
(SP1) (L ch) 

y

 AMP board)

lead wire (brown) 
(AMP board 

y

 JACK board)

lead wire 
(JACK board 

y

 

minus battery spring)

lead wire (red) 
(AMP board 

y

 plus battery spring)

lead wire (yellow) 
(AMP board 

y

 JACK board)

cord (with plug)

Note: Put a knot of the cord 

(with plug) into a 
groove of rear case.

rear case

JACK board

Note: The lead wires could be pinched between front case 

and rear case, resulting in cut-off.

Summary of Contents for SRS-T70

Page 1: ... US Model Canadian Model AEP Model E Model Tourist Model SRS T70 Notes on chip component replacement Never reuse a disconnected chip component Notice that the minus side of a tantalum capacitor may be dam aged by heat SPECIFICATIONS Ver 1 0 2000 01 ...

Page 2: ... 2 SECTION 1 GENERAL This section is extracted from instruction manual LOCATION OF CONTROLS ...

Page 3: ...N 2 DISASSEMBLY Note Follow the disassembly procedure in the numerical order given Set Speaker unit SP1 L ch Speaker unit SP2 R ch AMP board Jack board Front case 3 six screws P2 6 10 4 screw P2 5 1 Open the stand in the direction of arrow A 2 battery case lid 5 front case A ...

Page 4: ...e direction of arrow B 1 Remove two solders of speaker unit SP2 R ch lead 1 Remove two solders of speaker unit SP1 L ch lead 3 3 A B 8 four screws P2 6 6 5 four screws P2 6 10 7 acoustic absorbent 6 rear cabinet R 6 rear cabinet L 5 four screws P2 6 10 8 four screws P2 6 6 9 speaker unit SP2 R ch 0 front cabinet R assy 7 acoustic absorbent 9 speaker unit SP1 L ch 0 front cabinet L assy ...

Page 5: ...yellow brown from the JACK board and one red from plus battery spring For the colors of lead wires and PRECAUTION ON ROUTING THE LEAD WIRES see the following figure 2 two screws P2 5 3 JACK board 1 Disconnect three solders lead wire two yellow brown from the AMP board and one black from minus battery spring For the colors of lead wires and PRECAUTION ON ROUTING THE LEAD WIRES see the following fig...

Page 6: ...om the component side Y parts extracted from the conductor side z Through hole b Pattern from the side which enables seeing The other layers patterns are not indicated Caution Pattern face side Parts on the pattern face side seen from Conductor Side the pattern face are indicated Parts face side Parts on the parts face side seen from Component Side the parts face are indicated ...

Page 7: ...regulated dc power supply from external power voltage jack Voltages are dc with respect to ground under no signal conditions no mark POWER ON Voltages are taken with aVOM Input impedance 10 MΩ Voltage variations may be noted due to normal produc tion tolerances Signal path F LINE INPUT IC Block Diagram IC1 2 TEA2025D 013TR 20 19 18 17 16 15 14 11 13 12 THERMAL PROTECT START CIRCUIT 10 9 8 7 6 5 4 ...

Page 8: ...ECT CHIP 10uF 20 16V C18 1 109 982 11 CERAMIC CHIP 1uF 10 10V C19 1 109 982 11 CERAMIC CHIP 1uF 10 10V C20 1 109 982 11 CERAMIC CHIP 1uF 10 10V C21 1 109 982 11 CERAMIC CHIP 1uF 10 10V C22 1 126 935 11 ELECT 470uF 20 16V C23 1 163 021 11 CERAMIC CHIP 0 01uF 10 50V C24 1 163 035 00 CERAMIC CHIP 0 047uF 50V C25 1 163 035 00 CERAMIC CHIP 0 047uF 50V C26 1 163 009 11 CERAMIC CHIP 0 001uF 10 50V C101 1...

Page 9: ...7 685 133 19 SCREW P 2 6X6 TYPE2 SLIT 3 7 685 135 19 SCREW P 2 6X10 TYPE2 SLIT 4 7 621 255 40 SCREW P 2X6 ACCESSORIES PACKING MATERIALS 3 042 998 11 MANUAL INSTRUCTION ENGLISH SPANISH US 3 042 998 21 MANUAL INSTRUCTION ENGLISH FRENCH GERMAN ITALIAN SPANISH DUTCH SWEDISH PORTUGUESE Canadian AEP E Tourist 3 045 440 01 POUCH CARRYING ...

Page 10: ... 14 SRS T70 Sony Corporation Personal Audio Division Company 9 927 198 11 2000A0574 1 Printed in Japan C 2000 1 Published by General Engineering Dept ...

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