Sony WALKMAN D-CJ01, Service Manual

3

D-CJ01

The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the charged
electrostatic load, etc. on clothing and the human body. During repair,
pay attention to electrostatic breakdown and also use the procedure in
the printed matter which is included in the repair parts.
The flexible board is easily damaged and should be handled with care.

NOTES ON LASER DIODE EMISSION CHECK

The laser beam on this model is concentrated so as to be focused on the
disc reflective surface by the objective lens in the optical pick-up block.
Therefore, when checking the laser diode emission, observe from more
than 30cm away from the objective lens.

Before Replacing the Optical pick-up Block

Please be sure to check thoroughly the parameters as per the “Optical
pick-up Block Checking Procedure” (Part No. : 9-960-027-11) issued
separately before replacing the optical Pick-up block.
Note and specifications required to check are given below.

•  FOK output : IC601 

eg

 pin

When checking FOK, remove the lead wire to disc motor.

•  RF signal P-to-P value : 0.4 to 0.8Vp-p

USABLE FORMAT

Use ISO9660 Level 1 format

SECTION 1

SERVICING NOTES

Laser Diode Checking Methods

During normal operation of the equipment, emission of the laser diode
is prohibited unless the upper panel is closed while turning ON the S801
(push switch type).
The following checking method for the laser diode are operable.

Method :
Emission of the laser diode is visually checked.

1. Open the upper lid.
2. Push the S801 as shown in Fig. 1.
3. Check the object lens for confirming normal emission of the laser

diode. If not emitting, there is a trouble in the automatic power
control circuit or the optical pick-up. During normal operation, the
laser diode is turned ON about 2.5 seconds for focus searching.

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR
BASE UNIT

Fig.1 Method to push S801

S801

z

  UNLEADED SOLDER

Boards requiring use of unleaded solder are printed with the
lead-free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed
with the lead free mark due to their particular size.)

 : LEAD FREE MARK

Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40

°

C higher

than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to
be applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set
to about 350

°

C.

Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscous (sticky, less prone to
flow) than ordinary solder so use caution not to let solder
bridges occur such as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder
may also be added to ordinary solder.