Sony Walkman MZ-E909, Service Manual

28

MZ-E909

NOTE :

• Due to standardization, replacements in the

parts list may be different from the parts
specified in the diagrams or the components
used on the set.

• -XX,  -X mean standardized parts, so they

may have some difference from the original
one.

• RESISTORS

All resistors are in ohms
METAL : Metal-film resistor
METAL OXIDE :Metal oxide-film resistor
F : nonflammable

• Items marked “ * ”are not stocked since

they are seldom required for routine service.
Some delay should be anticipated when
ordering these items.

• SEMICONDUCTORS

In each case, u : 

µ

, for example :

uA.... : 

µ

A.... , uPA.... : 

µ

PA....

uPB.... : 

µ

PB.... , uPC.... : 

µ

PC....

uPD.... : 

µ

PD....

• CAPACITORS

uF : 

µ

F

• COILS

uH : 

µ

H

When indicating parts by reference num-
ber, please include the board.

The components identified by mark 

0

or dotted line with mark 

0

 are critical

for safety.
Replace only with part number specified.

SECTION 8

ELECTRICAL PARTS LIST

Ref. No.

Part No.

Description

Remark

Ref. No.

Part No.

Description

Remark

AUDIO

MAIN

AUDIO BOARD (included in MAIN

BOARD SUB ASSY)

********************

<CAPACITOR>

C101

1-125-837-91 CERAMIC CHIP

1uF

10%

6.3V

C102

1-127-569-91 TANTAL CHIP

100uF

20%

4V

C103

1-115-467-11 CERAMIC CHIP

0.22uF

10%

10V

C104

1-164-942-11 CERAMIC CHIP

0.0068uF 10%

16V

C201

1-125-837-91 CERAMIC CHIP

1uF

10%

6.3V

C202

1-127-569-91 TANTAL CHIP

100uF

20%

4V

C203

1-115-467-11 CERAMIC CHIP

0.22uF

10%

10V

C204

1-164-942-11 CERAMIC CHIP

0.0068uF 10%

16V

C301

1-117-919-11 TANTAL CHIP

10uF

20%

6.3V

C302

1-107-820-11 CERAMIC CHIP

0.1uF

16V

C303

1-125-837-91 CERAMIC CHIP

1uF

10%

6.3V

C304

1-125-926-91 TANTAL CHIP

4.7uF

20%

6.3V

C305

1-125-838-11 CERAMIC CHIP

2.2uF

10%

6.3V

C306

1-127-895-91 TANTAL CHIP

22uF

20%

4V

C803

1-164-935-11 CERAMIC CHIP

470PF

10%

16V

C804

1-164-943-11 CERAMIC CHIP

0.01uF

10%

16V

<CONNECTOR>

CN802

1-778-595-21 CONNECTOR, BOARD TO BOARD 20P

*

CN803

1-793-327-21 CONNECTOR, FPC(ZIF) 9P

<IC>

IC301

8-759-598-15 IC   TA2131FL(EL)

<TRANSISTOR>

Q301

8-729-598-15 TRANSISTOR   2SC4738

<RESISTOR>

R101

1-218-971-11 RES-CHIP

33K

5%

1/16W

R102

1-218-971-11 RES-CHIP

33K

5%

1/16W

R103

1-218-961-11 RES-CHIP

4.7K

5%

1/16W

R104

1-208-929-11 RES-CHIP

10

5%

1/16W

R106

1-218-963-11 RES-CHIP

6.8K

5%

1/16W

R201

1-218-971-11 RES-CHIP

33K

5%

1/16W

R202

1-218-971-11 RES-CHIP

33K

5%

1/16W

R203

1-218-961-11 RES-CHIP

4.7K

5%

1/16W

R204

1-208-929-11 RES-CHIP

10

5%

1/16W

R206

1-218-963-11 RES-CHIP

6.8K

5%

1/16W

R301

1-218-935-11 RES-CHIP

33

5%

1/16W

R302

1-218-963-11 RES-CHIP

6.8K

5%

1/16W

R303

1-218-981-11 RES-CHIP

220K

5%

1/16W

*****************************************************
*

X-3381-935-1 MAIN BOARD SUB ASSY (including AUDIO

 BOARD)

*******************

3-049-041-01 TERMINAL BOARD

<CAPACITOR>

C501

1-164-931-11 CERAMIC CHIP

100PF

10%

16V

C502

1-127-772-81 CERAMIC CHIP

33000PF

10%

10V

C503

1-164-940-11 CERAMIC CHIP

0.0033uF 10%

16V

C504

1-164-940-11 CERAMIC CHIP

0.0033uF 10%

16V

C505

1-164-943-11 CERAMIC CHIP

0.01uF

10%

16V

C508

1-164-938-11 CERAMIC CHIP

0.0015uF 10%

16V

C509

1-164-940-11 CERAMIC CHIP

0.0033uF 10%

16V

C510

1-164-850-11 CERAMIC CHIP

10PF

0.50PF 16V

C511

1-164-850-11 CERAMIC CHIP

10PF

0.50PF 16V

C513

1-164-850-11 CERAMIC CHIP

10PF

0.50PF 16V

C515

1-107-820-11 CERAMIC CHIP

0.1uF

16V

C516

1-125-777-11 CERAMIC CHIP

0.1uF

10%

10V

C519

1-164-940-11 CERAMIC CHIP

0.0033uF 10%

16V

C524

1-117-919-11 TANTAL CHIP

10uF

20%

6.3V

C526

1-127-772-81 CERAMIC CHIP

33000PF

10%

10V

C527

1-127-772-81 CERAMIC CHIP

33000PF

10%

10V

C529

1-137-762-91 TANTALUM

10uF

20%

4V

C530

1-164-939-11 CERAMIC CHIP

0.0022uF 10%

16V

C557

1-127-772-81 CERAMIC CHIP

33000PF

10%

10V

C558

1-127-772-81 CERAMIC CHIP

33000PF

10%

10V

C559

1-127-772-81 CERAMIC CHIP

33000PF

10%

10V

C563

1-127-772-81 CERAMIC CHIP

33000PF

10%

10V

C564

1-127-772-81 CERAMIC CHIP

33000PF

10%

10V

C565

1-127-772-81 CERAMIC CHIP

33000PF

10%

10V

C601

1-107-820-11 CERAMIC CHIP

0.1uF

16V

C603

1-107-820-11 CERAMIC CHIP

0.1uF

16V

C604

1-107-820-11 CERAMIC CHIP

0.1uF

16V

C605

1-115-156-11 CERAMIC CHIP

1uF

10V

C606

1-117-919-11 TANTAL CHIP

10uF

20%

6.3V

C607

1-115-156-11 CERAMIC CHIP

1uF

10V

C610

1-117-919-11 TANTAL CHIP

10uF

20%

6.3V

C611

1-164-943-11 CERAMIC CHIP

0.01uF

10%

16V

C612

1-125-891-11 CERAMIC CHIP

0.47uF

10%

10V

C613

1-164-935-11 CERAMIC CHIP

470PF

10%

16V

• Abbreviation

FR

: French

HK

: Hong Kong

JEW

: Tourist

MAIN BOARD SUB ASSY

• Audio board is supplied with main board sub

ASSY.

• Audio board can't be moved away from main

board.

Give a damage when take it off forcibly.

Ver 1.1 2001.11