Sony Walkman NW-E8P, Service Manual

2

NW-E8P

Specifications ............................................................................... 1

1. SERVICING NOTE

.......................................................... 2

2. GENERAL

.......................................................................... 3

3. DISASSEMBLY

3-1. Driver ASSY (SP2), Arm Lid (R), Holder Lid (R) ......... 6
3-2. Main Board, Power Board, LCD Unit ............................ 6
3-3. Driver ASSY (SP1), Arm Lid (L), Holder Lid (L) ......... 7

4. TEST MODE

...................................................................... 8

5. DIAGRAMS

5-1. Block Diagrams ............................................................ 10
5-2. Printed Wiring Boards (Main Section) ......................... 11
5-3. Schematic Diagram (Main Section (1/2)) ..................... 12
5-4. Schematic Diagram (Main Section (2/2)) ..................... 13
5-5. Printed Wiring Boards (Power Section) ........................ 14
5-6. Schematic Diagram (Power Section) ............................ 15

6. EXPLODED VIEW

6-1. L-CH Section ................................................................ 17
6-2. R-CH Section ................................................................ 18

7. ELECTRICAL PARTS LIST

....................................... 19

Flexible Circuit Board Repairing

• Keep the temperature of the soldering iron around 270

°

C during

repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering or

unsoldering.

Notes on chip component replacement

• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

TABLE OF CONTENTS

• Replacement of CXD9644GG (IC710) used in the set requires a special

tool.

z

  UNLEADED SOLDER

Boards requiring use of unleaded solder are printed with the
lead-free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed
with the lead free mark due to their particular size.)

 : LEAD FREE MARK

Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40

°

C higher

than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to
be applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set
to about 350

°

C.

Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscous (sticky, less prone to
flow) than ordinary solder so use caution not to let solder
bridges occur such as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder
may also be added to ordinary solder.

z

  USABLE FORMAT

Use ISO9660 Level 1 format.

SECTION 1

SERVICING NOTE