17
NW-MS6
Note on Printed Wiring Boards:
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side)
the parts face are indicated.
5-3.
NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
• Lead Layouts
surface
Lead layout of conventional IC
CSP (chip size package)
• MAIN board and SUB board are six-layer printed boards.
However, the patterns of layers 2 to 5 have not been included
in these diagrams.
*
Replacement of C5000, IC5600, IC7001and IC8000 used
in this set requires a special tool.
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
form that of conventional IC.
Note on Schematic Diagram:
• All capacitors are in
µ
F unless otherwise noted. pF:
µµ
F
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
%
: indicates tolerance.
•
A
: B+ Line.
• Power voltage is dc 1.2 V and fed with regulated dc power
supply from battery terminal.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
• no mark : PLAYBACK
(
) : when USB connection
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: PLAYBACK
E
: Check-out
j
: Check-in
*
Replacement of IC5000, IC5600, IC7001and IC8000
used in this set requires a special tool.
