2
NW-MS77DR
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40
°
C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°
C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
z
USABLE FORMAT
Use ISO9660 Level 1 format.
• IC401 (microcomputer), IC451 (frash RAM) on Main board
cannot be replaced individually.
Replace it with Main board assembly for service.
• IC461, 463 (frash RAM) on NAND board cannot be replaced
individually.
Replace it with NAND board assembly for service.
• When exchanging NAND board sub ASSY (for service),
SL701 of the B-side may be open.
In this case, please perform the solder bridge of SL701.
TABLE OF CONTENTS
Specifications ............................................................................ 1
1.
SERVICING NOTES
................................................ 3
2.
GENERAL
................................................................... 3
3.
TEST MODE
............................................................... 4
4.
DISASSEMBLY
4-1.
Disassembly Frow ........................................................... 5
4-2.
Case (U) Sub Assy, Play Unit .......................................... 5
4-3.
Lcd Board ........................................................................ 6
4-4.
Button (MS) Assy, Chassis (R) Assy ............................... 6
4-5.
NI-MH Battery, Power Board .......................................... 7
4-6.
Nand Board, Main Board ................................................ 7
5.
DIAGRAMS
5-1.
Block Diagrams ............................................................... 9
5-2.
Schematic Diagram – Main Section (1/2)– ..................... 10
5-3.
Schematic Diagram – Main Section (2/2)– ..................... 11
5-4.
Printed Wiring Boards – Main Section– .......................... 12
5-5.
Schematic Diagram – Lcd Section– ................................ 13
5-6.
Printed Wiring Boards – Lcd Section– ............................ 14
5-7.
Schematic Diagram – Nand Section– .............................. 15
5-8.
Printed Wiring Boards– Nand Section– .......................... 16
5-9.
Schematic Diagram – Power Section– ............................ 17
5-10. Printed Wiring Boards– Power Section– ......................... 18
6.
EXPLODED VIEWS
6-1.
Case Section .................................................................... 20
6-2.
Chassis Section ................................................................ 21
7.
ELECTRICAL PARTS LIST
.................................. 22
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270
°
C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
OpenMG and its logo are trademarks of Sony Corporation.
SonicStage and its logo are trademarks of Sony Corporation.
“MagicGate Memory Stick” is trademark of Sony Corporation.
“Memory Stick” and
are trademarks of Sony Corporation.
“Memory Stick Duo” and
are trademarks of Sony
Corporation.
“MagicGate” and
are trademarks of Sony Corporation.
ATRAC, ATRAC3, ATRAC3plus and their logos are trademarks
of Sony Corporation.
Microsoft, Windows and Windows Media are trademarks or
registered trademarks of Microsoft Corporation in the United
States and/or other countries.
US and foreign patents licensed from Dolby Laboratories.
All other trademarks and registered trademarks are trademarks or
registered trademarks of their respective holders.
In this manual, TM and R marks are not specified.
Ver 1.1
