WM-GX670/GX674
— 17 —
— 18 —
6-2. PRINTED WIRING BOARD
Note on Printed Wiring Board:
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
r
: Through hole.
•
b
: Pattern from the side which enables seeing.
Caution:
Pattern face side:
Parts on the pattern face side seen from
(SIDE B)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(SIDE A)
the parts face are indicated.
— 16 —
• Semiconductor Location
Ref. No.
Location
Ref. No.
Location
D1
A-14
D2
B-14
D3
F-14
D4
C-15
D5
B-8
D101
C-9
D201
C-9
D301
C-9
D302
B-9
D303
B-9
Ref. No.
Location
D801
D-4
D802
E-3
D803
D-3
D804
D-3
IC1
B-14
IC2
D-14
IC3
D-17
IC4
F-18
IC5
D-18
IC6
C-19
IC301
F-17
IC302
E-9
IC501
D-7
IC601
D-19
IC801
D-3
Q1
D-16
Q2
C-16
Q3
B-13
Q4
B-14
Q5
D-15
Q6
C-15
Q7
B-13
Q8
C-16
Q9
D-6
Q10
C-13
Q11
D-15
Q12
E-16
Q13
E-13
Ref. No.
Location
Q14
B-13
Q15
C-4
Q16
C-15
Q17
C-15
Q18
F-15
Q19
F-16
Q20
C-6
Q301
E-19
Q302
F-16
Q303
F-16
Ref. No.
Location
Ref. No.
Location
Q304
F-9
Q305
F-9
Q501
G-4
Q502
G-9
Q503
G-9
Q504
G-5
Q505
F-6
Q506
F-5
Q507
F-6
Q508
G-12
Q509
D-8
Q510
G-4
Q511
F-5
Q512
F-6
Q513
E-16
Q514
G-17
Q515
D-6
Q601
C-19
Q602
C-19
Q801
D-3
Q802
C-2
Q803
D-2
Q804
C-3
Q805
C-2
Ref. No.
Location
Ref. No.
Location
1
2
A
B
C
D
E
F
G
H
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
