Sony XDR-S40DBP, Service Manual

XDR-S40DBP

2

SECTION  1

SERVICING  NOTES

UNLEADED  SOLDER

Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(

Caution:

  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

 : LEAD  FREE  MARK

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

Soldering irons using a temperature regulator should be set to 
about 350 °C.

Caution:

 The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

Unleaded solder is more viscous (sticky, less prone to 

fl

 ow) 

than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

•  Usable with ordinary solder
 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

1. 

SERVICING  NOTES 

 .............................................   2

2. DISASSEMBLY

2-1. Disassembly 

Flow 

...........................................................   3

2-2.  Cabinet Rear Block .........................................................   4
2-3.  VOL Knob Block ............................................................   4
2-4.  Cabinet Front Assy (CAB1) ............................................   5
2-5. LCDDAB 

Board 

.............................................................   6

2-6. JACK 

Board 

....................................................................   7

2-7.  MAIN Board Block ........................................................   8
2-8. MAIN 

Board 

...................................................................   9

2-9.  Module Assy (DAB Module) (DAB1) ............................   9

3. 

TEST  MODE 

 ............................................................   10

4. DIAGRAMS

4-1.  Printed Wiring Board - MAIN Board - ...........................   14
4-2.  Schematic Diagram - MAIN Board - ..............................   15
4-3.  Printed Wiring Board - JACK Board - ............................   16
4-4.  Schematic Diagram - JACK Board - ..............................   17
4-5.  Schematic Diagram - LCDDAB Board - ........................   18
4-6.  Printed Wiring Board - LCDDAB Board - .....................   19

5. 

EXPLODED  VIEWS

5-1. Overall 

Section 

...............................................................  20

5-2.  Rear Cabinet Section ......................................................   21
5-3. Chassis 

Section 

...............................................................  22

5-4.  LCDDAB Board Section ................................................   23

6. 

ELECTRICAL  PARTS  LIST 

 ..............................   24

Accessories are given in the last of the electrical parts list.

TABLE  OF  CONTENTS