Alternative Motherboard Orientation and Heat Sink Mount Position
As the DB1 is symmetrical, the internals can be rotated 90 degrees to allow for an alternative motherboard orientation. This can be useful in situations where the
heat sink fin direction must be rotated 90 degrees in relation to the front panel for optimising cooling with different case placement. This is done by removing the
motherboard standoffs from the default installed location (marked on the heat sink with an arrow), to the alternative location indicated on the image below.
The motherboard orientation is independent of being able to rotate the front panel to allow for alternative I/O module location relative to the top/bottom of the
case and the I/O module can also be rotated for preferred USB / button orientation.
Another adjustment that can be made is the position of the heat sink mount retention brackets. For most motherboards, placement towards the front of the case is
optimal for applying pressure on the mount, however with thin-itx layouts, having the retention brackets towards the back of the case will allow for better pressure
as the mount will be flipped. Note that only the outer screw and spacer need to be moved as the bracket will pivot on the centre screw.
Heat Sink
Heat Sink Mount Retention Bracket
HCH-M3x12
2.5
HCH-M3x12
2.5
5
