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Chapter 1: Introduction
1.3 System Features
The following table provides an overview of the main features of the 6039P-E1CR16H/L.
Refer to Appendix C for additional specifications.
System Features
Motherboard
X11DPH-T
Chassis
836BE1C-R1K23B
CPU
Intel Xeon 81xx/61xx/51xx/41xx/31xx series processors* [Socket P0-LGA 3647 processor with up to 28 cores
and a thermal design power (TDP) of up to 205W]
Socket Type
P0-LGA 3647
Memory
Supports up to 512GB of RDIMM or 2TB of 3DS LRDIMM DDR4-2666 (288-pin) ECC memory in 16 DIMM slots
Chipset
Intel C624 chipset
Expansion Slots
Four PCI Express 3.0 x8 Slots
Three PCI Express 3.0 x16 Slots
(Slots 2 and 3 occupied by controller and JBOD expansion port)
Hard Drives
Sixteen 3.5" hard drives in hot-swap drive carriers (option for additional two 2.5" hard drives in the rear)
Power
Dual (redundant) 1200W power supply modules (p/n PWS-1K23A-1R)
Form Factor
3U rackmount
Dimensions
(WxHxD) 17.2 x 5.2 x 25.5 in. (437 x 132 x 647 mm)
*Note:
Does not support FPGA or Fabric processors.