C-1
Appendix C: BPN-SAS3-825MTQ Backplane Specifications
Appendix C
BPN-SAS3-825MTQ Backplane Specifications
C-1 ESD Safety Guidelines
Electrostatic Discharge (ESD) can damage electronic com ponents. To prevent
damage to your system, it is important to handle it very carefully. The following
measures are generally sufficient to protect your equipment from ESD.
•
Use a grounded wrist strap designed to prevent static discharge.
•
Touch a grounded metal object before removing a component from the antistatic
bag.
•
Handle the backplane by its edges only; do not touch its components, peripheral
chips, memory modules or gold contacts.
•
When handling chips or modules, avoid touching their pins.
•
Put the card and peripherals back into their antistatic bags when not in use.
C-2 General Safety Guidelines
•
Always disconnect power cables before installing or removing any components
from the computer, including the backplane.
•
Disconnect the power cable before installing or removing any cables from the
backplane.
•
Make sure that the backplane is securely and properly installed on the mother-
board to prevent damage to the system due to power shortage.
C-3 Version Information
The BPN-SAS3-825MTQ has been designed to utilize the most up-to-date
technology available, providing your system with reliable, high-quality performance.
This manual reflects BPN-SAS3-825MTQ revision 1.02, the most current release
available at the time of publication. Refer to
for the latest
updates, compatible parts and supported configurations.
Summary of Contents for SC825M Series
Page 12: ...SC825M B Chassis Manual 1 4 Notes ...
Page 32: ...2 20 SC825MB Chassis Manual Notes ...
Page 62: ...SC825M B Chassis Manual 5 24 Notes ...
Page 72: ...SC825M B Chassis Manual 6 10 Notes ...
Page 74: ...SC825M B Chassis Manual A 2 Notes ...
