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Appendix B: System Specifications
Appendix B
System Specifications
Processors
3rd Generation Intel® Xeon® Scalable series [Socket P+ (LGA4189)] processor with up to 40 cores and a thermal design
power (TDP) of up to 270W
Note: Refer to the motherboard specifications pages on our website for updates to supported processors.
Chipset
Intel PCH C621A
BIOS
256Mb AMI BIOS® SPI Flash BIOS
Memory
Eight slots support up to 2048GB of ECC RDIMM/LRDIMM/LRDIMM (3DS) with speeds up to 3200MHz; DIMM size up to
256GB at 1.2V
Storage Drives
Eight hot-swap 3.5" drive bays for SATA, or SAS with an optional add-on card and cable
Two SuperDOM (Disk on Module) headers
PCI Expansion Slots
Two PCIe 4.0 x16 (FHFL)
Two PCIe 4.0 x8 (LP)
One M.2 slot for PCIe 3.0 x4 or SATA 3.0 (supports M-Key 2280/22110 FF)
Input/Output
Network: Two 10GbE LAN ports
IPMI: Dedicated LAN port
USB: Two USB 3.2 Gen 1 ports, two USB 2.0 ports
Video : One VGA port
Serial: One serial port, one serial header
Motherboard
X12SPW-TF; 8" (W) x 13" (L) (203.2mm x 330.2mm)
Chassis
825BTQC-R609WB; 2U Rackmount, 17.2 x 3.5 x 25.5" / 437 x 89 x 647mm (W x H x D)
System Cooling
Three 8cm heavy duty fans, one CPU heatsink, one air shroud to direct air flow
Power Supply
Model: PWS-609P-1R2
AC Input Voltages: 100-240VAC
Rated Input Frequency: 50-60Hz
Rated Output Power: 600W Redundant
Rated Output Voltages: +12V (50A), +5VSB (4A)
Operating Environment
Operating Temperature: 10º to 35ºC (50º to 95ºF)
Non-operating Temperature: -40º to 60ºC (-40º to 140ºF)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)