Copyright TEL
31/01/96
Part A
Introduction To Servicing
This part of the manual is divided into the sections listed below. These sections provide
some general and advisory information on servicing procedures, a brief history of T800
programming software, and a list of Technical Instructions pertaining to T830 Series
equipment.
Section
Title
Page
1
1.1
1.2
1.3
General
Caution: CMOS Devices
Caution: Aerial Load
Caution: Beryllium Oxide & Power Transistors
1.1
1.1
1.2
1.2
2
2.1
2.2
2.2.1
2.2.2
2.3
Mechanical
Pozidriv Recess Head Screws
Disassembly/Reassembly
Receivers/Exciters
Power Amplifiers
Cover Screw Torques
2.1
2.1
2.1
2.1
2.1
2.1
3
3.1
3.1.1
3.1.2
3.2
Component Replacement
Leaded Components
Desoldering Iron Method
Component Cutting Method
Surface Mount Devices
3.1
3.1
3.1
3.1
3.2
4
To Replace PA Transistors
4.1
5
To Remove The T838 PA PCB From The Heatsink
5.1
6
To Remove Cased Mica Capacitors
6.1
7
7.1
7.2
7.3
Software History
BASEPROG V1/PGM800 V2
PGM800 V2.01
PGM800 V2.21
7.1
7.1
7.1
7.2
8
Technical Instructions
8.1
Figure
Title
Page
4.1
Typical Transistor/Capacitor Spacing
4.1
Summary of Contents for T830 Series
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